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Matériaux électroniques

Blindage EMI, mise à la masse et absorbeurs ECLEAR

Films conducteurs, tissus, rubans cuivre et absorbeurs ECLEAR sont choisis séparément selon la fonction électrique, la fréquence et la géométrie.

Illustration d’application: Blindage EMI, mise à la masse et absorbeurs ECLEAR
CONSTRUCTION TYPE

Ce que contient l’empilement du matériau.

Les couches sont présentées dans l’ordre fonctionnel ; la construction exacte dépend du grade.

  1. 01Conductive adhesive: liner / conductive acrylic adhesive
  2. 02Fabric tape: conductive textile / conductive PSA / liner
  3. 03Metal foil: Cu or Al / conductive PSA / liner
  4. 04Absorber: magnetic-polymer sheet / optional PSA / liner
CATALOGUE DES MODÈLES ECLEAR

Grades identifiés pour la sélection technique.

Chaque modèle ECLEAR correspond à un rôle et à une construction distincts. Les correspondances de fabrication restent maîtrisées dans le référentiel produit ECLEAR pour assurer la traçabilité.

45 / 45 références
Modèle ECLEARProduit / rôleConstruction / plage typeApplications
EC-EM-CF-101Grade du produit
10 µm Conductive Adhesive FilmGrade spécifié
Conductive acrylic adhesive film / release liner10 µm; 180° peel >=7 N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
10 micron conductive adhesive filmconductive PSA
EC-EM-CF-102Grade du produit
20 µm Conductive Adhesive FilmGrade spécifié
Conductive acrylic adhesive film / release liner20 µm; 180° peel >=12 N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
20 micron conductive adhesive filmconductive PSA
EC-EM-CF-103Grade du produit
30 µm Conductive Adhesive FilmGrade spécifié
Conductive acrylic adhesive film / release liner30 µm; 180° peel not individually stated N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
30 micron conductive adhesive filmconductive PSA
EC-EM-CF-104Grade du produit
40 µm Conductive Adhesive FilmGrade spécifié
Conductive acrylic adhesive film / release liner40 µm; 180° peel not individually stated N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
40 micron conductive adhesive filmconductive PSA
EC-EM-CF-105Grade du produit
50 µm Conductive Adhesive FilmGrade spécifié
Conductive acrylic adhesive film / release liner50 µm; 180° peel >=15 N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
50 micron conductive adhesive filmconductive PSA
EC-EM-CF-106Grade du produit
100 µm Conductive Adhesive FilmGrade spécifié
Conductive acrylic adhesive film / release liner100 µm; 180° peel >=19 N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
100 micron conductive adhesive filmconductive PSA
EC-EM-NW-101Grade du produit
15 µm Conductive Nonwoven Tape DevelopmentDéveloppement
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥6 N/25 mm (ASTM D3330); XY<0.2 Ω/sq; Z<0.02 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
FPC, PCB and antenna grounding
EC-EM-NW-102Grade du produit
20 µm Conductive Nonwoven Tape DevelopmentDéveloppement
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥8 N/25 mm (ASTM D3330)
FPC, PCB and antenna grounding
EC-EM-NW-103Grade du produit
30 µm Conductive Nonwoven Tape DevelopmentDéveloppement
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥10 N/25 mm (ASTM D3330); XY<0.1 Ω/sq
FPC, PCB and antenna grounding
EC-EM-NW-104Grade du produit
50 µm Conformable Conductive Nonwoven Tape DevelopmentDéveloppement
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥12 N/25 mm (ASTM D3330); XY<0.2; Z<0.05 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Curved FPC and PCB grounding
EC-EM-NW-105Grade du produit
100 µm Conductive Nonwoven Tape DevelopmentDéveloppement
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥15 N/25 mm (ASTM D3330); Z<0.08 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Gap-bridging conductive bonding
EC-EM-FB-101Grade du produit
30 µm Single-Sided Conductive Fabric Tape DevelopmentDéveloppement
Conductive woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel: ≥8 N/25 mm (ASTM D3330); XY<0.1; Z<0.05 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Cable, antenna and camera-module shielding
EC-EM-FB-102Grade du produit
50 µm Single-Sided Conductive Fabric Tape DevelopmentDéveloppement
Conductive woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel: ≥10 N/25 mm (ASTM D3330)
Cable, antenna and camera-module shielding
EC-EM-FB-103Grade du produit
120 µm Single-Sided Conductive Fabric Tape DevelopmentDéveloppement
Conductive woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel: ≥12 N/25 mm (ASTM D3330); XY<0.2 Ω/sq
EMI wrapping and height compensation
EC-EM-FB-201Grade du produit
30 µm Double-Sided Conductive Fabric Tape DevelopmentDéveloppement
Conductive acrylic PSA / woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥10 N/25 mm (ASTM D3330); XY<0.1 Ω/sq
FPC grounding and conductive assembly
EC-EM-FB-202Grade du produit
50 µm Double-Sided Conductive Fabric Tape DevelopmentDéveloppement
Conductive acrylic PSA / woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥12 N/25 mm (ASTM D3330)
FPC grounding and conductive assembly
EC-EM-FB-203Grade du produit
100 µm Double-Sided Conductive Fabric Tape DevelopmentDéveloppement
Conductive acrylic PSA / woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥15 N/25 mm (ASTM D3330); XY<0.2 Ω/sq
Grounding across moderate gaps
EC-EM-FB-204Grade du produit
485 µm Conductive Fabric Spacer Tape DevelopmentDéveloppement
Conductive acrylic PSA / woven fabric spacer / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥18 N/25 mm (ASTM D3330); height-build construction
Large-step grounding and EMI contact
EC-EM-BK-101Grade du produit
40 µm Matte-Black Conductive Fabric Tape DevelopmentDéveloppement
Matte-black conductive fabric / conductive acrylic PSA / linerDevelopment; 180° peel: ≥10 N/25 mm (ASTM D3330); conductive black coating
Display shielding and appearance control
EC-EM-BK-102Grade du produit
50 µm Matte-Black Conductive Fabric Tape DevelopmentDéveloppement
Matte-black conductive fabric / conductive acrylic PSA / linerDevelopment; 50 µm
Display shielding and appearance control
EC-EM-BK-103Grade du produit
50 µm Matte-Black Conductive Copper Tape DevelopmentDéveloppement
Matte-black thermal coating / copper foil / conductive acrylic PSA / linerDevelopment; 180° peel: ≥12 N/25 mm (ASTM D3330); matte heat-spreading coating
Shield cans and speaker modules
EC-EM-BK-104Grade du produit
90 µm Black PI/Copper Composite Tape DevelopmentDéveloppement
Matte-black PI single-sided tape / copper foil composite / linerDevelopment; source table marks electrical paths nonconductive; insulating/conformable
Appearance and insulation over copper structures
EC-EM-BK-105Grade du produit
25 µm Bright-Black Conductive Copper Tape DevelopmentDéveloppement
Bright-black conductive coating / copper foil / conductive acrylic PSA / linerDevelopment; conductive and alcohol-resistant
Compact EMI shielding with glossy-black appearance
EC-EM-CU-101Grade du produit
30 µm Single-Sided Conductive Copper TapeGrade spécifié
Copper foil / conductive acrylic PSA / liner30 µm; 180° peel: ≥10 N/25 mm (ASTM D3330); XY<0.05; Z<0.03 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Grounding, seam shielding and heat spreading
30 micron copper foil tape
EC-EM-CU-102Grade du produit
50 µm Single-Sided Conductive Copper TapeGrade spécifié
Copper foil / conductive acrylic PSA / liner50 µm; 180° peel: ≥12 N/25 mm (ASTM D3330); XY<0.05; Z<0.03 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Grounding and enclosure shielding
50 micron copper foil shielding tape
EC-EM-CU-103Grade du produit
45 µm Conformable Single-Sided Copper TapeGrade spécifié
Copper foil / conductive acrylic PSA / liner45 µm; 180° peel: ≥12 N/25 mm (ASTM D3330); low resistance; appearance/conformability control
Shield-can and speaker grounding
conformable copper foil tape
EC-EM-CU-104Grade du produit
25 µm Double-Sided Conductive Copper TapeGrade spécifié
Conductive acrylic PSA / copper foil / conductive acrylic PSA / liner25 µm; 180° peel, A and B: ≥8 N/25 mm (ASTM D3330); XY<0.05; Z<0.03 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Ultra-thin FPC grounding
ultra thin double sided copper tape
EC-EM-CU-105Grade du produit
20 µm Double-Sided Conductive Copper TapeGrade spécifié
Conductive acrylic PSA / copper foil / conductive acrylic PSA / liner20 µm; 180° peel, A and B: ≥8 N/25 mm (ASTM D3330); XY<0.10; Z<0.05 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Ultra-thin conductive bonding
20 micron double sided copper tape
EC-EM-CU-106Grade du produit
50 µm Double-Sided Conductive Copper TapeGrade spécifié
Conductive acrylic PSA / copper foil / conductive acrylic PSA / liner50 µm; 180° peel, A and B: ≥8 N/25 mm (ASTM D3330); XY<0.05; Z<0.03 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Conformable grounding and shielding
50 micron double sided copper tape
EC-EM-CU-107-DGrade du produit
Damp-Heat-Resistant Black/Clear Copper Tape DevelopmentDéveloppement
9 µm clear PSA / 6 µm copper foil / 35 µm black PSA / linerDevelopment; 50±5 µm; dual-85 30-day anti-oxidation target
Long-life humid-heat EMI assemblies
EC-EM-AB-101Grade du produit
0-3 GHz EMI Absorber, µ' 50±10Développement
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 50±10; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-102Grade du produit
0-3 GHz EMI Absorber, µ' 100±20Développement
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 100±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-103Grade du produit
0-3 GHz EMI Absorber, µ' 120±20Développement
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 120±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-104Grade du produit
0-3 GHz EMI Absorber, µ' 150±20Développement
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 150±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-105Grade du produit
0-3 GHz EMI Absorber, µ' 180±20Développement
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 180±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-106Grade du produit
0-3 GHz EMI Absorber, µ' 200±20Référence · données à confirmer
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerLifecycle conflict: present in S08, omitted from S09; permeability µ'@3 MHz 200±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-107Grade du produit
0-3 GHz EMI Absorber, µ' 250±20Développement
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 250±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-201Grade du produit
0.13 High-Frequency EMI Absorber DevelopmentDéveloppement
High-frequency magnetic-polymer absorber / 0.03 mm PSA / linerDevelopment; 1-10 GHz; µ'@3 MHz 40±5; 0.13 mm total: 0.10 absorber + 0.03 PSA
2.4 GHz Wi-Fi, antenna and processor noise suppression
EC-EM-AB-202Grade du produit
0.23 High-Frequency EMI Absorber DevelopmentDéveloppement
High-frequency magnetic-polymer absorber / 0.03 mm PSA / linerDevelopment; 1-10 GHz; µ'@3 MHz 40±5; 0.23 mm total: 0.20 absorber + 0.03 PSA
2.4 GHz Wi-Fi, antenna and processor noise suppression
EC-EM-AB-203Grade du produit
0.33 High-Frequency EMI Absorber DevelopmentDéveloppement
High-frequency magnetic-polymer absorber / 0.03 mm PSA / linerDevelopment; 1-10 GHz; µ'@3 MHz 40±5; 0.33 mm total: 0.30 absorber + 0.03 PSA
2.4 GHz Wi-Fi, antenna and processor noise suppression
EC-EM-TC-101Grade du produit
60 µm Brown Thermosetting Conductive FilmGrade spécifié
Brown thermosetting conductive adhesive film / release liner60 µm before and 40 µm after press; lap resistance ≤1 Ω at Φ = 1.0 mm; no initial tack; validate transfer, hot-press and cure conditions
SMT-reflow-compatible conductive bonding
thermosetting conductive adhesive film
EC-EM-TC-102Grade du produit
60 µm Black Thermosetting Conductive FilmGrade spécifié
Black thermosetting conductive adhesive film / release liner60 µm before and 38 µm after press; lap resistance ≤2 Ω at Φ = 1.0 mm; no initial tack; validate transfer, hot-press and cure conditions
Black SMT-reflow-compatible conductive bonding
black thermosetting conductive film
EC-EM-TC-103Grade du produit
40 µm Brown Thermosetting Conductive FilmGrade spécifié
Brown thermosetting conductive adhesive film / release liner40 µm before and 24 µm after press; lap resistance ≤1 Ω at Φ = 1.0 mm; no initial tack; validate transfer, hot-press and cure conditions
Thin conductive structural bonding
40 micron heat cure conductive adhesive
EC-EM-TC-104Grade du produit
40 µm Black Thermosetting Conductive FilmGrade spécifié
Black thermosetting conductive adhesive film / release liner40 µm before and 25 µm after press; lap resistance ≤2 Ω at Φ = 1.0 mm; no initial tack; validate transfer, hot-press and cure conditions
Thin black conductive structural bonding
black heat activated conductive film
EC-EM-UV-101-DGrade du produit
UV-Curable Gold-Plated Copper Tape DevelopmentDéveloppement
0.05-0.10 µm gold / 9 µm copper / 10 µm UV-conductive adhesive / linerDevelopment; 20±3 µm; low-PIM antenna-feed design
Antenna feedpoint conductive bonding
PRINCIPE DE FONCTIONNEMENT

Grounding, shielding and absorption solve different electromagnetic paths.

01Conductive adhesive films, fabrics and metal foils create electrical paths that can bridge seams, ground components and reduce coupling when the enclosure and contact design are correct. The adhesive alone cannot guarantee system-level shielding.

02Absorbers use magnetic and dielectric loss in a polymer composite to attenuate electromagnetic energy over a grade-specific frequency range. Placement, thickness, field orientation and proximity to antennas or wireless-power coils can change the result.

03Resistance must be reported with direction, contact load, geometry and fixture. Shielding or absorption claims must state frequency and assembled test conditions; a generic high-performance statement is not technically meaningful.

AVANTAGES CLÉS

Des performances définies autour de l’application.

Les avantages sont évalués sur le substrat, le procédé et l’assemblage final visés.

01

Material selection by electrical function rather than one generic EMI claim

02

Conformable grounding options for compact assemblies

03

Metal-foil routes for low-resistance paths and enclosure shielding

04

Absorber materials for grade-specific field attenuation

PARCOURS DE QUALIFICATION

De la définition du matériau à un empilement de production qualifié.

La qualification relie le matériau, la transformation et la ligne de production du client.

01Locate source & victim

Identify the noise path, frequency, field type and sensitive circuit.

02Choose function

Separate grounding, seam shielding, field absorption and thermal needs.

03Design contact

Set material, die-cut direction, overlap, compression and ground points.

04Measure in assembly

Verify resistance and EMC performance before and after aging and rework.

LISTE DE VALIDATION

Les preuves à réunir avant de libérer la spécification.

Utilisez des substrats, des conditions de procédé et des séquences de vieillissement représentatifs.

  • XY and Z resistance with stated load, contact area and fixture
  • Ground-path continuity through tolerance and mechanical aging
  • Shielding effectiveness at the relevant frequency and seam geometry
  • Absorption or field attenuation with specified thickness and position
  • Corrosion, adhesion, die-cut edge quality and rework durability
PROPRIÉTÉS TYPES

Toute valeur exige une méthode et une révision approuvée.

Les valeurs types orientent la sélection ; les limites maîtrisées proviennent de la TDS approuvée.

PropriétéValeur type / plageContrôle
ResistanceDirection, pressure and geometry dependentState XY/Z and method
ShieldingAssembly dependentDefine frequency and fixture
AbsorptionFrequency/thickness dependentGrade-specific data
BondingSubstrate and aging dependentApproved peel/shear method

Les valeurs types ne constituent pas des spécifications. Les limites finales dépendent de la TDS ECLEAR approuvée et de la validation client.

QUESTIONS FRÉQUENTES

Les questions des ingénieurs avant un essai en ligne.

Clarifiez le rôle du matériau, les interfaces et la fenêtre de procédé avant l’échantillonnage.

Is an EMI absorber the same as a conductive shield?+

No. A conductive shield redirects or contains current and fields through a conductive structure; an absorber dissipates part of the electromagnetic energy through material loss. Some assemblies use both.

How are ECLEAR EMI grades selected?+

Selection starts with the shielding or absorption target, frequency range, available thickness, grounding path, assembly pressure and reliability profile. Named ECLEAR grades are then compared using the current controlled TDS and a representative device-level test.

Can ECLEAR recommend a grade from an application description alone?+

A first shortlist is possible, but a production recommendation requires the substrate, layer construction, equipment, process sequence, test method and acceptance criteria. ECLEAR normally moves from requirement definition to laboratory matching, samples, line trial and a frozen approved specification.

Are the values shown on this page guaranteed specifications?+

No. Website values and constructions are selection guidance. Guaranteed limits, test conditions, packaging and shelf life are controlled only by the latest ECLEAR-approved TDS, quality agreement and customer qualification record.

APPLICATIONS RECOMMANDÉES

Domaines dans lesquels cette plateforme est évaluée.

Chaque application exige encore la compatibilité de l’empilement complet et la validation en ligne.

FPC and PCB groundingCables and camerasAntenna and enclosure controlDisplays and processorsPower electronics
FENÊTRE DE PROCÉDÉ

Paramètres à maîtriser.

Consignez la fenêtre de procédé complète, et non un seul réglage nominal.

  • Define whether the requirement is grounding, shielding, absorption or heat spreading.
  • Control die-cut direction, contact area, compression and conductive path.
  • Test resistance before and after representative aging and rework.
  • Validate at the relevant frequency and assembled geometry.
QUESTIONS DE SÉLECTION

Les informations dont nous avons besoin.

Ces données permettent à ECLEAR de cibler le grade et le plan de validation.

  1. Q1What noise source, victim circuit and frequency range are involved?
  2. Q2Is a direct electrical path or field absorption required?
  3. Q3What thickness, compression and grounding points are available?
  4. Q4What thermal and environmental exposure occurs?
RISQUES DE DÉFAILLANCE

Ce qu’un essai rigoureux doit révéler rapidement.

Les contrôles précoces réduisent les risques de mise à l’échelle et les comparaisons erronées.

!

Treating shielding and absorption as interchangeable

!

Reporting resistance without direction, load or geometry

!

Poor contact caused by insufficient pressure or surface contamination

!

Creating an unintended antenna or ground path in the assembly

DOCUMENTS TÉLÉCHARGEABLES

Documents techniques maîtrisés.

Demandez la révision en vigueur pour le grade ECLEAR et l’application sélectionnés.

PDFBulletin produitDisponible après examen du contrôle documentaireDemander →PDFTDS simplifiéeDisponible après examen du contrôle documentaireDemander →PDFSDS et dossier de conformitéDisponible après examen du contrôle documentaireDemander →

Les constructions types et les concepts d’application sont fournis uniquement pour la sélection du matériau. La disponibilité, la structure, les performances et les conditions de procédé dépendent du grade et restent soumises à la dernière TDS approuvée par ECLEAR, aux essais d’application et à la qualification finale du client.

PRODUITS ASSOCIÉS

Systèmes de matériaux associés.

Examinez les matériaux adjacents qui interagissent avec ce produit dans le même empilement ou procédé.

EC-FP · EC-GR · EC-FM · EC-HTFPC, Graphite & Foam Process Films↗EC-EV · EC-FC · EC-SCEV Battery & Semiconductor Process Materials↗
CONSULTATION TECHNIQUE

Validez l’empilement complet, pas un matériau isolé.

Communiquez le substrat, la construction, le procédé et les critères d’acceptation pour une recommandation ciblée.

Démarrer un projet ↗
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