®전자 소재
EMI Shielding, Grounding & Absorber Solutions
이 기술 제품군의 ECLEAR 모델, 소재 구조, 적용 분야, 공정 범위 및 검증 요구사항을 확인하십시오.
소재 적층 구조의 구성.
층은 기능 순서로 표시되며 정확한 구조는 등급별로 달라집니다.
- 01Conductive adhesive: liner / conductive acrylic adhesive
- 02Fabric tape: conductive textile / conductive PSA / liner
- 03Metal foil: Cu or Al / conductive PSA / liner
- 04Absorber: magnetic-polymer sheet / optional PSA / liner
기술 선정을 위한 개별 등급.
각 ECLEAR 모델은 서로 다른 소재 역할과 구조를 나타냅니다. 제조사 등급 대응 정보는 추적성을 위해 ECLEAR 제품 마스터에서 관리됩니다.
45 / 45 개 기록
ECLEAR 모델제품 / 역할구조 / 대표 범위적용 분야
EC-EM-CF-101제품 등급
10 µm Conductive Adhesive Film규정 등급
Conductive acrylic adhesive film / release liner10 µm; 180° peel >=7 N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
10 micron conductive adhesive filmconductive PSA
EC-EM-CF-102제품 등급
20 µm Conductive Adhesive Film규정 등급
Conductive acrylic adhesive film / release liner20 µm; 180° peel >=12 N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
20 micron conductive adhesive filmconductive PSA
EC-EM-CF-103제품 등급
30 µm Conductive Adhesive Film규정 등급
Conductive acrylic adhesive film / release liner30 µm; 180° peel not individually stated N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
30 micron conductive adhesive filmconductive PSA
EC-EM-CF-104제품 등급
40 µm Conductive Adhesive Film규정 등급
Conductive acrylic adhesive film / release liner40 µm; 180° peel not individually stated N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
40 micron conductive adhesive filmconductive PSA
EC-EM-CF-105제품 등급
50 µm Conductive Adhesive Film규정 등급
Conductive acrylic adhesive film / release liner50 µm; 180° peel >=15 N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
50 micron conductive adhesive filmconductive PSA
EC-EM-CF-106제품 등급
100 µm Conductive Adhesive Film규정 등급
Conductive acrylic adhesive film / release liner100 µm; 180° peel >=19 N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
100 micron conductive adhesive filmconductive PSA
EC-EM-NW-101제품 등급
15 µm Conductive Nonwoven Tape Development개발
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥6 N/25 mm (ASTM D3330); XY<0.2 Ω/sq; Z<0.02 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
FPC, PCB and antenna grounding
EC-EM-NW-102제품 등급
20 µm Conductive Nonwoven Tape Development개발
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥8 N/25 mm (ASTM D3330)
FPC, PCB and antenna grounding
EC-EM-NW-103제품 등급
30 µm Conductive Nonwoven Tape Development개발
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥10 N/25 mm (ASTM D3330); XY<0.1 Ω/sq
FPC, PCB and antenna grounding
EC-EM-NW-104제품 등급
50 µm Conformable Conductive Nonwoven Tape Development개발
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥12 N/25 mm (ASTM D3330); XY<0.2; Z<0.05 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Curved FPC and PCB grounding
EC-EM-NW-105제품 등급
100 µm Conductive Nonwoven Tape Development개발
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥15 N/25 mm (ASTM D3330); Z<0.08 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Gap-bridging conductive bonding
EC-EM-FB-101제품 등급
30 µm Single-Sided Conductive Fabric Tape Development개발
Conductive woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel: ≥8 N/25 mm (ASTM D3330); XY<0.1; Z<0.05 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Cable, antenna and camera-module shielding
EC-EM-FB-102제품 등급
50 µm Single-Sided Conductive Fabric Tape Development개발
Conductive woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel: ≥10 N/25 mm (ASTM D3330)
Cable, antenna and camera-module shielding
EC-EM-FB-103제품 등급
120 µm Single-Sided Conductive Fabric Tape Development개발
Conductive woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel: ≥12 N/25 mm (ASTM D3330); XY<0.2 Ω/sq
EMI wrapping and height compensation
EC-EM-FB-201제품 등급
30 µm Double-Sided Conductive Fabric Tape Development개발
Conductive acrylic PSA / woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥10 N/25 mm (ASTM D3330); XY<0.1 Ω/sq
FPC grounding and conductive assembly
EC-EM-FB-202제품 등급
50 µm Double-Sided Conductive Fabric Tape Development개발
Conductive acrylic PSA / woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥12 N/25 mm (ASTM D3330)
FPC grounding and conductive assembly
EC-EM-FB-203제품 등급
100 µm Double-Sided Conductive Fabric Tape Development개발
Conductive acrylic PSA / woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥15 N/25 mm (ASTM D3330); XY<0.2 Ω/sq
Grounding across moderate gaps
EC-EM-FB-204제품 등급
485 µm Conductive Fabric Spacer Tape Development개발
Conductive acrylic PSA / woven fabric spacer / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥18 N/25 mm (ASTM D3330); height-build construction
Large-step grounding and EMI contact
EC-EM-BK-101제품 등급
40 µm Matte-Black Conductive Fabric Tape Development개발
Matte-black conductive fabric / conductive acrylic PSA / linerDevelopment; 180° peel: ≥10 N/25 mm (ASTM D3330); conductive black coating
Display shielding and appearance control
EC-EM-BK-102제품 등급
50 µm Matte-Black Conductive Fabric Tape Development개발
Matte-black conductive fabric / conductive acrylic PSA / linerDevelopment; 50 µm
Display shielding and appearance control
EC-EM-BK-103제품 등급
50 µm Matte-Black Conductive Copper Tape Development개발
Matte-black thermal coating / copper foil / conductive acrylic PSA / linerDevelopment; 180° peel: ≥12 N/25 mm (ASTM D3330); matte heat-spreading coating
Shield cans and speaker modules
EC-EM-BK-104제품 등급
90 µm Black PI/Copper Composite Tape Development개발
Matte-black PI single-sided tape / copper foil composite / linerDevelopment; source table marks electrical paths nonconductive; insulating/conformable
Appearance and insulation over copper structures
EC-EM-BK-105제품 등급
25 µm Bright-Black Conductive Copper Tape Development개발
Bright-black conductive coating / copper foil / conductive acrylic PSA / linerDevelopment; conductive and alcohol-resistant
Compact EMI shielding with glossy-black appearance
EC-EM-CU-101제품 등급
30 µm Single-Sided Conductive Copper Tape규정 등급
Copper foil / conductive acrylic PSA / liner30 µm; 180° peel: ≥10 N/25 mm (ASTM D3330); XY<0.05; Z<0.03 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Grounding, seam shielding and heat spreading
30 micron copper foil tape
EC-EM-CU-102제품 등급
50 µm Single-Sided Conductive Copper Tape규정 등급
Copper foil / conductive acrylic PSA / liner50 µm; 180° peel: ≥12 N/25 mm (ASTM D3330); XY<0.05; Z<0.03 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Grounding and enclosure shielding
50 micron copper foil shielding tape
EC-EM-CU-103제품 등급
45 µm Conformable Single-Sided Copper Tape규정 등급
Copper foil / conductive acrylic PSA / liner45 µm; 180° peel: ≥12 N/25 mm (ASTM D3330); low resistance; appearance/conformability control
Shield-can and speaker grounding
conformable copper foil tape
EC-EM-CU-104제품 등급
25 µm Double-Sided Conductive Copper Tape규정 등급
Conductive acrylic PSA / copper foil / conductive acrylic PSA / liner25 µm; 180° peel, A and B: ≥8 N/25 mm (ASTM D3330); XY<0.05; Z<0.03 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Ultra-thin FPC grounding
ultra thin double sided copper tape
EC-EM-CU-105제품 등급
20 µm Double-Sided Conductive Copper Tape규정 등급
Conductive acrylic PSA / copper foil / conductive acrylic PSA / liner20 µm; 180° peel, A and B: ≥8 N/25 mm (ASTM D3330); XY<0.10; Z<0.05 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Ultra-thin conductive bonding
20 micron double sided copper tape
EC-EM-CU-106제품 등급
50 µm Double-Sided Conductive Copper Tape규정 등급
Conductive acrylic PSA / copper foil / conductive acrylic PSA / liner50 µm; 180° peel, A and B: ≥8 N/25 mm (ASTM D3330); XY<0.05; Z<0.03 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Conformable grounding and shielding
50 micron double sided copper tape
EC-EM-CU-107-D제품 등급
Damp-Heat-Resistant Black/Clear Copper Tape Development개발
9 µm clear PSA / 6 µm copper foil / 35 µm black PSA / linerDevelopment; 50±5 µm; dual-85 30-day anti-oxidation target
Long-life humid-heat EMI assemblies
EC-EM-AB-101제품 등급
0-3 GHz EMI Absorber, µ' 50±10개발
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 50±10; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-102제품 등급
0-3 GHz EMI Absorber, µ' 100±20개발
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 100±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-103제품 등급
0-3 GHz EMI Absorber, µ' 120±20개발
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 120±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-104제품 등급
0-3 GHz EMI Absorber, µ' 150±20개발
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 150±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-105제품 등급
0-3 GHz EMI Absorber, µ' 180±20개발
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 180±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-106제품 등급
0-3 GHz EMI Absorber, µ' 200±20참고 · 데이터 확인
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerLifecycle conflict: present in S08, omitted from S09; permeability µ'@3 MHz 200±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-107제품 등급
0-3 GHz EMI Absorber, µ' 250±20개발
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 250±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-201제품 등급
0.13 High-Frequency EMI Absorber Development개발
High-frequency magnetic-polymer absorber / 0.03 mm PSA / linerDevelopment; 1-10 GHz; µ'@3 MHz 40±5; 0.13 mm total: 0.10 absorber + 0.03 PSA
2.4 GHz Wi-Fi, antenna and processor noise suppression
EC-EM-AB-202제품 등급
0.23 High-Frequency EMI Absorber Development개발
High-frequency magnetic-polymer absorber / 0.03 mm PSA / linerDevelopment; 1-10 GHz; µ'@3 MHz 40±5; 0.23 mm total: 0.20 absorber + 0.03 PSA
2.4 GHz Wi-Fi, antenna and processor noise suppression
EC-EM-AB-203제품 등급
0.33 High-Frequency EMI Absorber Development개발
High-frequency magnetic-polymer absorber / 0.03 mm PSA / linerDevelopment; 1-10 GHz; µ'@3 MHz 40±5; 0.33 mm total: 0.30 absorber + 0.03 PSA
2.4 GHz Wi-Fi, antenna and processor noise suppression
EC-EM-TC-101제품 등급
60 µm Brown Thermosetting Conductive Film규정 등급
Brown thermosetting conductive adhesive film / release liner60 µm before and 40 µm after press; lap resistance ≤1 Ω at Φ = 1.0 mm; no initial tack; validate transfer, hot-press and cure conditions
SMT-reflow-compatible conductive bonding
thermosetting conductive adhesive film
EC-EM-TC-102제품 등급
60 µm Black Thermosetting Conductive Film규정 등급
Black thermosetting conductive adhesive film / release liner60 µm before and 38 µm after press; lap resistance ≤2 Ω at Φ = 1.0 mm; no initial tack; validate transfer, hot-press and cure conditions
Black SMT-reflow-compatible conductive bonding
black thermosetting conductive film
EC-EM-TC-103제품 등급
40 µm Brown Thermosetting Conductive Film규정 등급
Brown thermosetting conductive adhesive film / release liner40 µm before and 24 µm after press; lap resistance ≤1 Ω at Φ = 1.0 mm; no initial tack; validate transfer, hot-press and cure conditions
Thin conductive structural bonding
40 micron heat cure conductive adhesive
EC-EM-TC-104제품 등급
40 µm Black Thermosetting Conductive Film규정 등급
Black thermosetting conductive adhesive film / release liner40 µm before and 25 µm after press; lap resistance ≤2 Ω at Φ = 1.0 mm; no initial tack; validate transfer, hot-press and cure conditions
Thin black conductive structural bonding
black heat activated conductive film
EC-EM-UV-101-D제품 등급
UV-Curable Gold-Plated Copper Tape Development개발
0.05-0.10 µm gold / 9 µm copper / 10 µm UV-conductive adhesive / linerDevelopment; 20±3 µm; low-PIM antenna-feed design
Antenna feedpoint conductive bonding
Grounding, shielding and absorption solve different electromagnetic paths.
01Conductive adhesive films, fabrics and metal foils create electrical paths that can bridge seams, ground components and reduce coupling when the enclosure and contact design are correct. The adhesive alone cannot guarantee system-level shielding.
02Absorbers use magnetic and dielectric loss in a polymer composite to attenuate electromagnetic energy over a grade-specific frequency range. Placement, thickness, field orientation and proximity to antennas or wireless-power coils can change the result.
03Resistance must be reported with direction, contact load, geometry and fixture. Shielding or absorption claims must state frequency and assembled test conditions; a generic high-performance statement is not technically meaningful.
적용 조건을 기준으로 평가한 성능.
장점은 실제 기재, 공정 및 최종 조립체에서 평가합니다.
01
Material selection by electrical function rather than one generic EMI claim
02
Conformable grounding options for compact assemblies
03
Metal-foil routes for low-resistance paths and enclosure shielding
04
Absorber materials for grade-specific field attenuation
소재 정의부터 양산 적층 구조 승인까지.
승인 절차는 소재, 가공 경로 및 고객 생산 라인을 함께 연결합니다.
01Locate source & victim
Identify the noise path, frequency, field type and sensitive circuit.
02Choose function
Separate grounding, seam shielding, field absorption and thermal needs.
03Design contact
Set material, die-cut direction, overlap, compression and ground points.
04Measure in assembly
Verify resistance and EMC performance before and after aging and rework.
사양 승인 전에 확보할 검증 자료.
대표 기재, 공정 조건 및 노화 순서를 사용하십시오.
- XY and Z resistance with stated load, contact area and fixture
- Ground-path continuity through tolerance and mechanical aging
- Shielding effectiveness at the relevant frequency and seam geometry
- Absorption or field attenuation with specified thickness and position
- Corrosion, adhesion, die-cut edge quality and rework durability
모든 수치에는 시험 방법과 승인된 개정본이 필요합니다.
대표값은 선정에 활용하며 관리 규격은 승인된 TDS를 따릅니다.
특성대표값 / 범위관리 기준
ResistanceDirection, pressure and geometry dependentState XY/Z and method
ShieldingAssembly dependentDefine frequency and fixture
AbsorptionFrequency/thickness dependentGrade-specific data
BondingSubstrate and aging dependentApproved peel/shear method
대표값은 보증 규격이 아닙니다. 최종 기준은 승인된 ECLEAR TDS와 고객 검증 결과를 따릅니다.
라인 시험 전에 엔지니어가 확인할 질문.
샘플 요청 전에 소재 역할, 계면 및 공정 범위를 정의하십시오.
Is an EMI absorber the same as a conductive shield?+
No. A conductive shield redirects or contains current and fields through a conductive structure; an absorber dissipates part of the electromagnetic energy through material loss. Some assemblies use both.
How are ECLEAR EMI grades selected?+
Selection starts with the shielding or absorption target, frequency range, available thickness, grounding path, assembly pressure and reliability profile. Named ECLEAR grades are then compared using the current controlled TDS and a representative device-level test.
Can ECLEAR recommend a grade from an application description alone?+
A first shortlist is possible, but a production recommendation requires the substrate, layer construction, equipment, process sequence, test method and acceptance criteria. ECLEAR normally moves from requirement definition to laboratory matching, samples, line trial and a frozen approved specification.
Are the values shown on this page guaranteed specifications?+
No. Website values and constructions are selection guidance. Guaranteed limits, test conditions, packaging and shelf life are controlled only by the latest ECLEAR-approved TDS, quality agreement and customer qualification record.
이 플랫폼을 평가하는 적용 분야.
각 적용에는 전체 적층 구조의 호환성과 라인 검증이 필요합니다.
공정 윈도우
관리해야 할 공정 변수.
하나의 명목 조건이 아니라 전체 공정 범위를 기록하십시오.
- Define whether the requirement is grounding, shielding, absorption or heat spreading.
- Control die-cut direction, contact area, compression and conductive path.
- Test resistance before and after representative aging and rework.
- Validate at the relevant frequency and assembled geometry.
선정 질문
선정에 필요한 정보.
이 정보로 ECLEAR가 적합한 등급과 검증 계획을 좁힐 수 있습니다.
- Q1What noise source, victim circuit and frequency range are involved?
- Q2Is a direct electrical path or field absorption required?
- Q3What thickness, compression and grounding points are available?
- Q4What thermal and environmental exposure occurs?
체계적인 시험에서 조기에 드러나야 할 위험.
조기 고장 검사는 양산 확대 위험과 잘못된 소재 비교를 줄입니다.
!
Treating shielding and absorption as interchangeable
!
Reporting resistance without direction, load or geometry
!
Poor contact caused by insufficient pressure or surface contamination
!
Creating an unintended antenna or ground path in the assembly
관리되는 기술 문서.
선정한 ECLEAR 등급과 적용 분야의 최신 개정본을 요청하십시오.
대표 구조와 적용 개념은 소재 선정을 위한 정보입니다. 공급 여부, 구조, 성능 및 공정 조건은 등급별로 다르며 최신 ECLEAR 승인 TDS, 적용 시험 및 고객의 최종 승인에 따릅니다.
관련 소재 시스템.
동일한 적층 구조나 공정에서 이 제품과 상호 작용하는 인접 소재를 확인하십시오.
기술 상담
프로젝트 시작 ↗한 가지 소재가 아니라 전체 적층 구조를 검증하십시오.
정확한 제안을 위해 기재, 구조, 공정 및 합격 기준을 알려 주십시오.