®電子材料
EMI Shielding, Grounding & Absorber Solutions
この技術製品群のECLEARモデル、材料構成、用途、プロセスウィンドウ、検証要件をご確認ください。
材料積層構造の内容.
各層は機能順に示しており、正確な構成はグレードごとに異なります。
- 01Conductive adhesive: liner / conductive acrylic adhesive
- 02Fabric tape: conductive textile / conductive PSA / liner
- 03Metal foil: Cu or Al / conductive PSA / liner
- 04Absorber: magnetic-polymer sheet / optional PSA / liner
技術選定用の個別グレード.
各 ECLEAR モデルは、異なる材料の役割と構成を示します。製造元グレードとの対応情報は、トレーサビリティーのため ECLEAR 製品マスターで管理されます。
45 / 45 件
ECLEAR モデル製品 / 役割構成 / 代表範囲用途
EC-EM-CF-101製品グレード
10 µm Conductive Adhesive Film規定グレード
Conductive acrylic adhesive film / release liner10 µm; 180° peel >=7 N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
10 micron conductive adhesive filmconductive PSA
EC-EM-CF-102製品グレード
20 µm Conductive Adhesive Film規定グレード
Conductive acrylic adhesive film / release liner20 µm; 180° peel >=12 N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
20 micron conductive adhesive filmconductive PSA
EC-EM-CF-103製品グレード
30 µm Conductive Adhesive Film規定グレード
Conductive acrylic adhesive film / release liner30 µm; 180° peel not individually stated N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
30 micron conductive adhesive filmconductive PSA
EC-EM-CF-104製品グレード
40 µm Conductive Adhesive Film規定グレード
Conductive acrylic adhesive film / release liner40 µm; 180° peel not individually stated N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
40 micron conductive adhesive filmconductive PSA
EC-EM-CF-105製品グレード
50 µm Conductive Adhesive Film規定グレード
Conductive acrylic adhesive film / release liner50 µm; 180° peel >=15 N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
50 micron conductive adhesive filmconductive PSA
EC-EM-CF-106製品グレード
100 µm Conductive Adhesive Film規定グレード
Conductive acrylic adhesive film / release liner100 µm; 180° peel >=19 N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
100 micron conductive adhesive filmconductive PSA
EC-EM-NW-101製品グレード
15 µm Conductive Nonwoven Tape Development開発中
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥6 N/25 mm (ASTM D3330); XY<0.2 Ω/sq; Z<0.02 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
FPC, PCB and antenna grounding
EC-EM-NW-102製品グレード
20 µm Conductive Nonwoven Tape Development開発中
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥8 N/25 mm (ASTM D3330)
FPC, PCB and antenna grounding
EC-EM-NW-103製品グレード
30 µm Conductive Nonwoven Tape Development開発中
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥10 N/25 mm (ASTM D3330); XY<0.1 Ω/sq
FPC, PCB and antenna grounding
EC-EM-NW-104製品グレード
50 µm Conformable Conductive Nonwoven Tape Development開発中
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥12 N/25 mm (ASTM D3330); XY<0.2; Z<0.05 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Curved FPC and PCB grounding
EC-EM-NW-105製品グレード
100 µm Conductive Nonwoven Tape Development開発中
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥15 N/25 mm (ASTM D3330); Z<0.08 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Gap-bridging conductive bonding
EC-EM-FB-101製品グレード
30 µm Single-Sided Conductive Fabric Tape Development開発中
Conductive woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel: ≥8 N/25 mm (ASTM D3330); XY<0.1; Z<0.05 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Cable, antenna and camera-module shielding
EC-EM-FB-102製品グレード
50 µm Single-Sided Conductive Fabric Tape Development開発中
Conductive woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel: ≥10 N/25 mm (ASTM D3330)
Cable, antenna and camera-module shielding
EC-EM-FB-103製品グレード
120 µm Single-Sided Conductive Fabric Tape Development開発中
Conductive woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel: ≥12 N/25 mm (ASTM D3330); XY<0.2 Ω/sq
EMI wrapping and height compensation
EC-EM-FB-201製品グレード
30 µm Double-Sided Conductive Fabric Tape Development開発中
Conductive acrylic PSA / woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥10 N/25 mm (ASTM D3330); XY<0.1 Ω/sq
FPC grounding and conductive assembly
EC-EM-FB-202製品グレード
50 µm Double-Sided Conductive Fabric Tape Development開発中
Conductive acrylic PSA / woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥12 N/25 mm (ASTM D3330)
FPC grounding and conductive assembly
EC-EM-FB-203製品グレード
100 µm Double-Sided Conductive Fabric Tape Development開発中
Conductive acrylic PSA / woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥15 N/25 mm (ASTM D3330); XY<0.2 Ω/sq
Grounding across moderate gaps
EC-EM-FB-204製品グレード
485 µm Conductive Fabric Spacer Tape Development開発中
Conductive acrylic PSA / woven fabric spacer / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥18 N/25 mm (ASTM D3330); height-build construction
Large-step grounding and EMI contact
EC-EM-BK-101製品グレード
40 µm Matte-Black Conductive Fabric Tape Development開発中
Matte-black conductive fabric / conductive acrylic PSA / linerDevelopment; 180° peel: ≥10 N/25 mm (ASTM D3330); conductive black coating
Display shielding and appearance control
EC-EM-BK-102製品グレード
50 µm Matte-Black Conductive Fabric Tape Development開発中
Matte-black conductive fabric / conductive acrylic PSA / linerDevelopment; 50 µm
Display shielding and appearance control
EC-EM-BK-103製品グレード
50 µm Matte-Black Conductive Copper Tape Development開発中
Matte-black thermal coating / copper foil / conductive acrylic PSA / linerDevelopment; 180° peel: ≥12 N/25 mm (ASTM D3330); matte heat-spreading coating
Shield cans and speaker modules
EC-EM-BK-104製品グレード
90 µm Black PI/Copper Composite Tape Development開発中
Matte-black PI single-sided tape / copper foil composite / linerDevelopment; source table marks electrical paths nonconductive; insulating/conformable
Appearance and insulation over copper structures
EC-EM-BK-105製品グレード
25 µm Bright-Black Conductive Copper Tape Development開発中
Bright-black conductive coating / copper foil / conductive acrylic PSA / linerDevelopment; conductive and alcohol-resistant
Compact EMI shielding with glossy-black appearance
EC-EM-CU-101製品グレード
30 µm Single-Sided Conductive Copper Tape規定グレード
Copper foil / conductive acrylic PSA / liner30 µm; 180° peel: ≥10 N/25 mm (ASTM D3330); XY<0.05; Z<0.03 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Grounding, seam shielding and heat spreading
30 micron copper foil tape
EC-EM-CU-102製品グレード
50 µm Single-Sided Conductive Copper Tape規定グレード
Copper foil / conductive acrylic PSA / liner50 µm; 180° peel: ≥12 N/25 mm (ASTM D3330); XY<0.05; Z<0.03 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Grounding and enclosure shielding
50 micron copper foil shielding tape
EC-EM-CU-103製品グレード
45 µm Conformable Single-Sided Copper Tape規定グレード
Copper foil / conductive acrylic PSA / liner45 µm; 180° peel: ≥12 N/25 mm (ASTM D3330); low resistance; appearance/conformability control
Shield-can and speaker grounding
conformable copper foil tape
EC-EM-CU-104製品グレード
25 µm Double-Sided Conductive Copper Tape規定グレード
Conductive acrylic PSA / copper foil / conductive acrylic PSA / liner25 µm; 180° peel, A and B: ≥8 N/25 mm (ASTM D3330); XY<0.05; Z<0.03 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Ultra-thin FPC grounding
ultra thin double sided copper tape
EC-EM-CU-105製品グレード
20 µm Double-Sided Conductive Copper Tape規定グレード
Conductive acrylic PSA / copper foil / conductive acrylic PSA / liner20 µm; 180° peel, A and B: ≥8 N/25 mm (ASTM D3330); XY<0.10; Z<0.05 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Ultra-thin conductive bonding
20 micron double sided copper tape
EC-EM-CU-106製品グレード
50 µm Double-Sided Conductive Copper Tape規定グレード
Conductive acrylic PSA / copper foil / conductive acrylic PSA / liner50 µm; 180° peel, A and B: ≥8 N/25 mm (ASTM D3330); XY<0.05; Z<0.03 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Conformable grounding and shielding
50 micron double sided copper tape
EC-EM-CU-107-D製品グレード
Damp-Heat-Resistant Black/Clear Copper Tape Development開発中
9 µm clear PSA / 6 µm copper foil / 35 µm black PSA / linerDevelopment; 50±5 µm; dual-85 30-day anti-oxidation target
Long-life humid-heat EMI assemblies
EC-EM-AB-101製品グレード
0-3 GHz EMI Absorber, µ' 50±10開発中
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 50±10; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-102製品グレード
0-3 GHz EMI Absorber, µ' 100±20開発中
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 100±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-103製品グレード
0-3 GHz EMI Absorber, µ' 120±20開発中
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 120±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-104製品グレード
0-3 GHz EMI Absorber, µ' 150±20開発中
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 150±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-105製品グレード
0-3 GHz EMI Absorber, µ' 180±20開発中
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 180±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-106製品グレード
0-3 GHz EMI Absorber, µ' 200±20参考・データ確認
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerLifecycle conflict: present in S08, omitted from S09; permeability µ'@3 MHz 200±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-107製品グレード
0-3 GHz EMI Absorber, µ' 250±20開発中
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 250±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-201製品グレード
0.13 High-Frequency EMI Absorber Development開発中
High-frequency magnetic-polymer absorber / 0.03 mm PSA / linerDevelopment; 1-10 GHz; µ'@3 MHz 40±5; 0.13 mm total: 0.10 absorber + 0.03 PSA
2.4 GHz Wi-Fi, antenna and processor noise suppression
EC-EM-AB-202製品グレード
0.23 High-Frequency EMI Absorber Development開発中
High-frequency magnetic-polymer absorber / 0.03 mm PSA / linerDevelopment; 1-10 GHz; µ'@3 MHz 40±5; 0.23 mm total: 0.20 absorber + 0.03 PSA
2.4 GHz Wi-Fi, antenna and processor noise suppression
EC-EM-AB-203製品グレード
0.33 High-Frequency EMI Absorber Development開発中
High-frequency magnetic-polymer absorber / 0.03 mm PSA / linerDevelopment; 1-10 GHz; µ'@3 MHz 40±5; 0.33 mm total: 0.30 absorber + 0.03 PSA
2.4 GHz Wi-Fi, antenna and processor noise suppression
EC-EM-TC-101製品グレード
60 µm Brown Thermosetting Conductive Film規定グレード
Brown thermosetting conductive adhesive film / release liner60 µm before and 40 µm after press; lap resistance ≤1 Ω at Φ = 1.0 mm; no initial tack; validate transfer, hot-press and cure conditions
SMT-reflow-compatible conductive bonding
thermosetting conductive adhesive film
EC-EM-TC-102製品グレード
60 µm Black Thermosetting Conductive Film規定グレード
Black thermosetting conductive adhesive film / release liner60 µm before and 38 µm after press; lap resistance ≤2 Ω at Φ = 1.0 mm; no initial tack; validate transfer, hot-press and cure conditions
Black SMT-reflow-compatible conductive bonding
black thermosetting conductive film
EC-EM-TC-103製品グレード
40 µm Brown Thermosetting Conductive Film規定グレード
Brown thermosetting conductive adhesive film / release liner40 µm before and 24 µm after press; lap resistance ≤1 Ω at Φ = 1.0 mm; no initial tack; validate transfer, hot-press and cure conditions
Thin conductive structural bonding
40 micron heat cure conductive adhesive
EC-EM-TC-104製品グレード
40 µm Black Thermosetting Conductive Film規定グレード
Black thermosetting conductive adhesive film / release liner40 µm before and 25 µm after press; lap resistance ≤2 Ω at Φ = 1.0 mm; no initial tack; validate transfer, hot-press and cure conditions
Thin black conductive structural bonding
black heat activated conductive film
EC-EM-UV-101-D製品グレード
UV-Curable Gold-Plated Copper Tape Development開発中
0.05-0.10 µm gold / 9 µm copper / 10 µm UV-conductive adhesive / linerDevelopment; 20±3 µm; low-PIM antenna-feed design
Antenna feedpoint conductive bonding
Grounding, shielding and absorption solve different electromagnetic paths.
01Conductive adhesive films, fabrics and metal foils create electrical paths that can bridge seams, ground components and reduce coupling when the enclosure and contact design are correct. The adhesive alone cannot guarantee system-level shielding.
02Absorbers use magnetic and dielectric loss in a polymer composite to attenuate electromagnetic energy over a grade-specific frequency range. Placement, thickness, field orientation and proximity to antennas or wireless-power coils can change the result.
03Resistance must be reported with direction, contact load, geometry and fixture. Shielding or absorption claims must state frequency and assembled test conditions; a generic high-performance statement is not technically meaningful.
用途を基準に評価する性能.
利点は、対象基材、工程、最終アセンブリで評価します。
01
Material selection by electrical function rather than one generic EMI claim
02
Conformable grounding options for compact assemblies
03
Metal-foil routes for low-resistance paths and enclosure shielding
04
Absorber materials for grade-specific field attenuation
材料定義から量産積層構造の認定まで.
認定では、材料、加工経路、顧客の生産ラインを一体として確認します。
01Locate source & victim
Identify the noise path, frequency, field type and sensitive circuit.
02Choose function
Separate grounding, seam shielding, field absorption and thermal needs.
03Design contact
Set material, die-cut direction, overlap, compression and ground points.
04Measure in assembly
Verify resistance and EMC performance before and after aging and rework.
仕様承認前に収集すべき検証データ.
実使用を代表する基材、工程条件、エージング順序を使用してください。
- XY and Z resistance with stated load, contact area and fixture
- Ground-path continuity through tolerance and mechanical aging
- Shielding effectiveness at the relevant frequency and seam geometry
- Absorption or field attenuation with specified thickness and position
- Corrosion, adhesion, die-cut edge quality and rework durability
数値には試験方法と承認済み改訂版が必要です.
代表値は選定の参考であり、管理規格は承認済み TDS に従います。
特性代表値 / 範囲管理
ResistanceDirection, pressure and geometry dependentState XY/Z and method
ShieldingAssembly dependentDefine frequency and fixture
AbsorptionFrequency/thickness dependentGrade-specific data
BondingSubstrate and aging dependentApproved peel/shear method
代表値は保証規格ではありません。最終基準は承認済みECLEAR TDSとお客様の検証結果に従います。
ライン試験前に技術者が確認する質問.
サンプル依頼前に、材料の役割、界面、工程範囲を明確にしてください。
Is an EMI absorber the same as a conductive shield?+
No. A conductive shield redirects or contains current and fields through a conductive structure; an absorber dissipates part of the electromagnetic energy through material loss. Some assemblies use both.
How are ECLEAR EMI grades selected?+
Selection starts with the shielding or absorption target, frequency range, available thickness, grounding path, assembly pressure and reliability profile. Named ECLEAR grades are then compared using the current controlled TDS and a representative device-level test.
Can ECLEAR recommend a grade from an application description alone?+
A first shortlist is possible, but a production recommendation requires the substrate, layer construction, equipment, process sequence, test method and acceptance criteria. ECLEAR normally moves from requirement definition to laboratory matching, samples, line trial and a frozen approved specification.
Are the values shown on this page guaranteed specifications?+
No. Website values and constructions are selection guidance. Guaranteed limits, test conditions, packaging and shelf life are controlled only by the latest ECLEAR-approved TDS, quality agreement and customer qualification record.
このプラットフォームを評価する用途.
各用途で、積層構造全体の適合性とライン検証が必要です。
プロセスウィンドウ
管理すべき工程パラメータ.
一つの公称条件だけでなく、工程範囲全体を記録してください。
- Define whether the requirement is grounding, shielding, absorption or heat spreading.
- Control die-cut direction, contact area, compression and conductive path.
- Test resistance before and after representative aging and rework.
- Validate at the relevant frequency and assembled geometry.
選定時の確認事項
選定に必要な情報.
これらの情報により、ECLEAR はグレードと検証計画を絞り込めます。
- Q1What noise source, victim circuit and frequency range are involved?
- Q2Is a direct electrical path or field absorption required?
- Q3What thickness, compression and grounding points are available?
- Q4What thermal and environmental exposure occurs?
計画的な試験で早期に確認すべきリスク.
早期の不具合確認により、量産拡大のリスクと誤った材料比較を低減します。
!
Treating shielding and absorption as interchangeable
!
Reporting resistance without direction, load or geometry
!
Poor contact caused by insufficient pressure or surface contamination
!
Creating an unintended antenna or ground path in the assembly
管理された技術文書.
選定した ECLEAR グレードと用途に対応する最新版を請求してください。
代表構成と用途概念は、材料選定のための情報です。供給状況、構成、性能、工程条件はグレードごとに異なり、最新の ECLEAR 承認 TDS、用途試験、および顧客の最終認定に従います。
関連材料システム.
同じ積層構造または工程で本製品と相互作用する周辺材料を確認してください。
技術相談
プロジェクトを開始 ↗単一材料ではなく、積層構造全体を検証してください.
適切な提案のため、基材、構成、工程、合格基準をご提示ください。