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EMI, Energy & Semiconductor Materials

EMI Shielding & Absorber Solutions

A family-level solution platform covering conductive adhesive films, conductive fabric or nonwoven tapes, conductive metal foils and electromagnetic absorbers. Shielding, grounding and absorption are distinct functions and are specified separately for the device geometry and frequency environment.

Application illustration: EMI Shielding & Absorber Solutions
TYPICAL CONSTRUCTION

What the material stack contains.

Read the layers in functional order; the exact construction remains grade-specific.

  1. 01Conductive adhesive: liner / conductive acrylic adhesive
  2. 02Fabric tape: conductive textile / conductive PSA / liner
  3. 03Metal foil: Cu or Al / conductive PSA / liner
  4. 04Absorber: magnetic-polymer sheet / optional PSA / liner
ECLEAR MODEL CATALOG

Named grades for technical selection.

Each ECLEAR model identifies a distinct material role and construction. Manufacturing cross-references remain controlled in the ECLEAR product master for traceability.

45 / 45 records
ECLEAR modelProduct / roleConstruction / typical windowApplications
EC-EM-CF-101Product grade
10 µm Conductive Adhesive FilmSpecified grade
Conductive acrylic adhesive film / release liner10 µm; 180° peel >=7 N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
10 micron conductive adhesive filmconductive PSA
EC-EM-CF-102Product grade
20 µm Conductive Adhesive FilmSpecified grade
Conductive acrylic adhesive film / release liner20 µm; 180° peel >=12 N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
20 micron conductive adhesive filmconductive PSA
EC-EM-CF-103Product grade
30 µm Conductive Adhesive FilmSpecified grade
Conductive acrylic adhesive film / release liner30 µm; 180° peel not individually stated N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
30 micron conductive adhesive filmconductive PSA
EC-EM-CF-104Product grade
40 µm Conductive Adhesive FilmSpecified grade
Conductive acrylic adhesive film / release liner40 µm; 180° peel not individually stated N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
40 micron conductive adhesive filmconductive PSA
EC-EM-CF-105Product grade
50 µm Conductive Adhesive FilmSpecified grade
Conductive acrylic adhesive film / release liner50 µm; 180° peel >=15 N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
50 micron conductive adhesive filmconductive PSA
EC-EM-CF-106Product grade
100 µm Conductive Adhesive FilmSpecified grade
Conductive acrylic adhesive film / release liner100 µm; 180° peel >=19 N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
100 micron conductive adhesive filmconductive PSA
EC-EM-NW-101Product grade
15 µm Conductive Nonwoven Tape DevelopmentDevelopment
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥6 N/25 mm (ASTM D3330); XY<0.2 Ω/sq; Z<0.02 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
FPC, PCB and antenna grounding
EC-EM-NW-102Product grade
20 µm Conductive Nonwoven Tape DevelopmentDevelopment
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥8 N/25 mm (ASTM D3330)
FPC, PCB and antenna grounding
EC-EM-NW-103Product grade
30 µm Conductive Nonwoven Tape DevelopmentDevelopment
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥10 N/25 mm (ASTM D3330); XY<0.1 Ω/sq
FPC, PCB and antenna grounding
EC-EM-NW-104Product grade
50 µm Conformable Conductive Nonwoven Tape DevelopmentDevelopment
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥12 N/25 mm (ASTM D3330); XY<0.2; Z<0.05 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Curved FPC and PCB grounding
EC-EM-NW-105Product grade
100 µm Conductive Nonwoven Tape DevelopmentDevelopment
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥15 N/25 mm (ASTM D3330); Z<0.08 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Gap-bridging conductive bonding
EC-EM-FB-101Product grade
30 µm Single-Sided Conductive Fabric Tape DevelopmentDevelopment
Conductive woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel: ≥8 N/25 mm (ASTM D3330); XY<0.1; Z<0.05 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Cable, antenna and camera-module shielding
EC-EM-FB-102Product grade
50 µm Single-Sided Conductive Fabric Tape DevelopmentDevelopment
Conductive woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel: ≥10 N/25 mm (ASTM D3330)
Cable, antenna and camera-module shielding
EC-EM-FB-103Product grade
120 µm Single-Sided Conductive Fabric Tape DevelopmentDevelopment
Conductive woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel: ≥12 N/25 mm (ASTM D3330); XY<0.2 Ω/sq
EMI wrapping and height compensation
EC-EM-FB-201Product grade
30 µm Double-Sided Conductive Fabric Tape DevelopmentDevelopment
Conductive acrylic PSA / woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥10 N/25 mm (ASTM D3330); XY<0.1 Ω/sq
FPC grounding and conductive assembly
EC-EM-FB-202Product grade
50 µm Double-Sided Conductive Fabric Tape DevelopmentDevelopment
Conductive acrylic PSA / woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥12 N/25 mm (ASTM D3330)
FPC grounding and conductive assembly
EC-EM-FB-203Product grade
100 µm Double-Sided Conductive Fabric Tape DevelopmentDevelopment
Conductive acrylic PSA / woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥15 N/25 mm (ASTM D3330); XY<0.2 Ω/sq
Grounding across moderate gaps
EC-EM-FB-204Product grade
485 µm Conductive Fabric Spacer Tape DevelopmentDevelopment
Conductive acrylic PSA / woven fabric spacer / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥18 N/25 mm (ASTM D3330); height-build construction
Large-step grounding and EMI contact
EC-EM-BK-101Product grade
40 µm Matte-Black Conductive Fabric Tape DevelopmentDevelopment
Matte-black conductive fabric / conductive acrylic PSA / linerDevelopment; 180° peel: ≥10 N/25 mm (ASTM D3330); conductive black coating
Display shielding and appearance control
EC-EM-BK-102Product grade
50 µm Matte-Black Conductive Fabric Tape DevelopmentDevelopment
Matte-black conductive fabric / conductive acrylic PSA / linerDevelopment; 50 µm
Display shielding and appearance control
EC-EM-BK-103Product grade
50 µm Matte-Black Conductive Copper Tape DevelopmentDevelopment
Matte-black thermal coating / copper foil / conductive acrylic PSA / linerDevelopment; 180° peel: ≥12 N/25 mm (ASTM D3330); matte heat-spreading coating
Shield cans and speaker modules
EC-EM-BK-104Product grade
90 µm Black PI/Copper Composite Tape DevelopmentDevelopment
Matte-black PI single-sided tape / copper foil composite / linerDevelopment; source table marks electrical paths nonconductive; insulating/conformable
Appearance and insulation over copper structures
EC-EM-BK-105Product grade
25 µm Bright-Black Conductive Copper Tape DevelopmentDevelopment
Bright-black conductive coating / copper foil / conductive acrylic PSA / linerDevelopment; conductive and alcohol-resistant
Compact EMI shielding with glossy-black appearance
EC-EM-CU-101Product grade
30 µm Single-Sided Conductive Copper TapeSpecified grade
Copper foil / conductive acrylic PSA / liner30 µm; 180° peel: ≥10 N/25 mm (ASTM D3330); XY<0.05; Z<0.03 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Grounding, seam shielding and heat spreading
30 micron copper foil tape
EC-EM-CU-102Product grade
50 µm Single-Sided Conductive Copper TapeSpecified grade
Copper foil / conductive acrylic PSA / liner50 µm; 180° peel: ≥12 N/25 mm (ASTM D3330); XY<0.05; Z<0.03 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Grounding and enclosure shielding
50 micron copper foil shielding tape
EC-EM-CU-103Product grade
45 µm Conformable Single-Sided Copper TapeSpecified grade
Copper foil / conductive acrylic PSA / liner45 µm; 180° peel: ≥12 N/25 mm (ASTM D3330); low resistance; appearance/conformability control
Shield-can and speaker grounding
conformable copper foil tape
EC-EM-CU-104Product grade
25 µm Double-Sided Conductive Copper TapeSpecified grade
Conductive acrylic PSA / copper foil / conductive acrylic PSA / liner25 µm; 180° peel, A and B: ≥8 N/25 mm (ASTM D3330); XY<0.05; Z<0.03 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Ultra-thin FPC grounding
ultra thin double sided copper tape
EC-EM-CU-105Product grade
20 µm Double-Sided Conductive Copper TapeSpecified grade
Conductive acrylic PSA / copper foil / conductive acrylic PSA / liner20 µm; 180° peel, A and B: ≥8 N/25 mm (ASTM D3330); XY<0.10; Z<0.05 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Ultra-thin conductive bonding
20 micron double sided copper tape
EC-EM-CU-106Product grade
50 µm Double-Sided Conductive Copper TapeSpecified grade
Conductive acrylic PSA / copper foil / conductive acrylic PSA / liner50 µm; 180° peel, A and B: ≥8 N/25 mm (ASTM D3330); XY<0.05; Z<0.03 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Conformable grounding and shielding
50 micron double sided copper tape
EC-EM-CU-107-DProduct grade
Damp-Heat-Resistant Black/Clear Copper Tape DevelopmentDevelopment
9 µm clear PSA / 6 µm copper foil / 35 µm black PSA / linerDevelopment; 50±5 µm; dual-85 30-day anti-oxidation target
Long-life humid-heat EMI assemblies
EC-EM-AB-101Product grade
0-3 GHz EMI Absorber, µ' 50±10Development
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 50±10; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-102Product grade
0-3 GHz EMI Absorber, µ' 100±20Development
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 100±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-103Product grade
0-3 GHz EMI Absorber, µ' 120±20Development
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 120±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-104Product grade
0-3 GHz EMI Absorber, µ' 150±20Development
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 150±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-105Product grade
0-3 GHz EMI Absorber, µ' 180±20Development
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 180±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-106Product grade
0-3 GHz EMI Absorber, µ' 200±20Reference · confirm data
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerLifecycle conflict: present in S08, omitted from S09; permeability µ'@3 MHz 200±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-107Product grade
0-3 GHz EMI Absorber, µ' 250±20Development
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 250±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-201Product grade
0.13 High-Frequency EMI Absorber DevelopmentDevelopment
High-frequency magnetic-polymer absorber / 0.03 mm PSA / linerDevelopment; 1-10 GHz; µ'@3 MHz 40±5; 0.13 mm total: 0.10 absorber + 0.03 PSA
2.4 GHz Wi-Fi, antenna and processor noise suppression
EC-EM-AB-202Product grade
0.23 High-Frequency EMI Absorber DevelopmentDevelopment
High-frequency magnetic-polymer absorber / 0.03 mm PSA / linerDevelopment; 1-10 GHz; µ'@3 MHz 40±5; 0.23 mm total: 0.20 absorber + 0.03 PSA
2.4 GHz Wi-Fi, antenna and processor noise suppression
EC-EM-AB-203Product grade
0.33 High-Frequency EMI Absorber DevelopmentDevelopment
High-frequency magnetic-polymer absorber / 0.03 mm PSA / linerDevelopment; 1-10 GHz; µ'@3 MHz 40±5; 0.33 mm total: 0.30 absorber + 0.03 PSA
2.4 GHz Wi-Fi, antenna and processor noise suppression
EC-EM-TC-101Product grade
60 µm Brown Thermosetting Conductive FilmSpecified grade
Brown thermosetting conductive adhesive film / release liner60 µm before and 40 µm after press; lap resistance ≤1 Ω at Φ = 1.0 mm; no initial tack; validate transfer, hot-press and cure conditions
SMT-reflow-compatible conductive bonding
thermosetting conductive adhesive film
EC-EM-TC-102Product grade
60 µm Black Thermosetting Conductive FilmSpecified grade
Black thermosetting conductive adhesive film / release liner60 µm before and 38 µm after press; lap resistance ≤2 Ω at Φ = 1.0 mm; no initial tack; validate transfer, hot-press and cure conditions
Black SMT-reflow-compatible conductive bonding
black thermosetting conductive film
EC-EM-TC-103Product grade
40 µm Brown Thermosetting Conductive FilmSpecified grade
Brown thermosetting conductive adhesive film / release liner40 µm before and 24 µm after press; lap resistance ≤1 Ω at Φ = 1.0 mm; no initial tack; validate transfer, hot-press and cure conditions
Thin conductive structural bonding
40 micron heat cure conductive adhesive
EC-EM-TC-104Product grade
40 µm Black Thermosetting Conductive FilmSpecified grade
Black thermosetting conductive adhesive film / release liner40 µm before and 25 µm after press; lap resistance ≤2 Ω at Φ = 1.0 mm; no initial tack; validate transfer, hot-press and cure conditions
Thin black conductive structural bonding
black heat activated conductive film
EC-EM-UV-101-DProduct grade
UV-Curable Gold-Plated Copper Tape DevelopmentDevelopment
0.05-0.10 µm gold / 9 µm copper / 10 µm UV-conductive adhesive / linerDevelopment; 20±3 µm; low-PIM antenna-feed design
Antenna feedpoint conductive bonding
HOW IT WORKS

Grounding, shielding and absorption solve different electromagnetic paths.

01Conductive adhesive films, fabrics and metal foils create electrical paths that can bridge seams, ground components and reduce coupling when the enclosure and contact design are correct. The adhesive alone cannot guarantee system-level shielding.

02Absorbers use magnetic and dielectric loss in a polymer composite to attenuate electromagnetic energy over a grade-specific frequency range. Placement, thickness, field orientation and proximity to antennas or wireless-power coils can change the result.

03Resistance must be reported with direction, contact load, geometry and fixture. Shielding or absorption claims must state frequency and assembled test conditions; a generic high-performance statement is not technically meaningful.

KEY BENEFITS

Performance framed around the application.

Benefits are evaluated on the intended substrate, process and finished assembly.

01

Material selection by electrical function rather than one generic EMI claim

02

Conformable grounding options for compact assemblies

03

Metal-foil routes for low-resistance paths and enclosure shielding

04

Absorber materials for grade-specific field attenuation

APPLICATION WORKFLOW

From material definition to a qualified production stack.

Qualification links the material, converting route and customer production line.

01Locate source & victim

Identify the noise path, frequency, field type and sensitive circuit.

02Choose function

Separate grounding, seam shielding, field absorption and thermal needs.

03Design contact

Set material, die-cut direction, overlap, compression and ground points.

04Measure in assembly

Verify resistance and EMC performance before and after aging and rework.

VALIDATION PLAN

Evidence to collect before specification release.

Use representative substrates, process conditions and aging sequences.

  • XY and Z resistance with stated load, contact area and fixture
  • Ground-path continuity through tolerance and mechanical aging
  • Shielding effectiveness at the relevant frequency and seam geometry
  • Absorption or field attenuation with specified thickness and position
  • Corrosion, adhesion, die-cut edge quality and rework durability
TYPICAL PROPERTIES

Values require a method and an approved revision.

Typical values support selection; controlled specifications come from the approved TDS.

PropertyTypical / rangeControl
ResistanceDirection, pressure and geometry dependentState XY/Z and method
ShieldingAssembly dependentDefine frequency and fixture
AbsorptionFrequency/thickness dependentGrade-specific data
BondingSubstrate and aging dependentApproved peel/shear method

Typical values are not specifications. Final limits are subject to the approved ECLEAR TDS and customer validation.

TECHNICAL FAQ

Questions engineers ask before a line trial.

Resolve the material role, interfaces and process window before sampling.

Is an EMI absorber the same as a conductive shield?+

No. A conductive shield redirects or contains current and fields through a conductive structure; an absorber dissipates part of the electromagnetic energy through material loss. Some assemblies use both.

How are ECLEAR EMI grades selected?+

Selection starts with the shielding or absorption target, frequency range, available thickness, grounding path, assembly pressure and reliability profile. Named ECLEAR grades are then compared using the current controlled TDS and a representative device-level test.

Can ECLEAR recommend a grade from an application description alone?+

A first shortlist is possible, but a production recommendation requires the substrate, layer construction, equipment, process sequence, test method and acceptance criteria. ECLEAR normally moves from requirement definition to laboratory matching, samples, line trial and a frozen approved specification.

Are the values shown on this page guaranteed specifications?+

No. Website values and constructions are selection guidance. Guaranteed limits, test conditions, packaging and shelf life are controlled only by the latest ECLEAR-approved TDS, quality agreement and customer qualification record.

RECOMMENDED APPLICATIONS

Where this platform is evaluated.

Each application still requires stack-level compatibility and line validation.

FPC and PCB groundingCables and camerasAntenna and enclosure controlDisplays and processorsPower electronics
PROCESS WINDOW

Parameters to control.

Record the complete process window, not only one nominal setting.

  • Define whether the requirement is grounding, shielding, absorption or heat spreading.
  • Control die-cut direction, contact area, compression and conductive path.
  • Test resistance before and after representative aging and rework.
  • Validate at the relevant frequency and assembled geometry.
SELECTION QUESTIONS

What we need to know.

These inputs allow ECLEAR to narrow the grade and validation plan.

  1. Q1What noise source, victim circuit and frequency range are involved?
  2. Q2Is a direct electrical path or field absorption required?
  3. Q3What thickness, compression and grounding points are available?
  4. Q4What thermal and environmental exposure occurs?
FAILURE RISKS

What a disciplined trial should expose early.

Early failure checks reduce scale-up risk and prevent false material comparisons.

!

Treating shielding and absorption as interchangeable

!

Reporting resistance without direction, load or geometry

!

Poor contact caused by insufficient pressure or surface contamination

!

Creating an unintended antenna or ground path in the assembly

DOWNLOADABLE DOCUMENTS

Controlled technical documents.

Request the current revision for the selected ECLEAR grade and application.

PDFProduct BulletinAvailable after document-control reviewRequest →PDFSimplified TDSAvailable after document-control reviewRequest →PDFSDS & Compliance PackAvailable after document-control reviewRequest →

Typical constructions and application concepts are provided for material selection only. Availability, structure, performance and process conditions are grade-specific and subject to the latest ECLEAR-approved TDS, application testing and final customer qualification.

RELATED PRODUCTS

Related material systems.

Review adjacent materials that interact with this product in the same stack or process.

EC-FP · EC-GR · EC-FM · EC-HTFPC, Graphite & Foam Process Films↗EC-EV · EC-FC · EC-SCEV Battery & Semiconductor Process Materials↗
TECHNICAL CONSULTATION

Validate the complete stack, not one isolated material.

Share the substrate, construction, process and acceptance criteria for a focused recommendation.

Start a project ↗
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