®Elektronik malzemeler
EMI Shielding, Grounding & Absorber Solutions
Bu teknik aile için ECLEAR modellerini, malzeme yapısını, uygulamaları, proses penceresini ve doğrulama gereksinimlerini inceleyin.
Malzeme yapısında neler bulunur.
Katmanlar işlev sırasıyla gösterilir; kesin yapı ürün sınıfına özeldir.
- 01Conductive adhesive: liner / conductive acrylic adhesive
- 02Fabric tape: conductive textile / conductive PSA / liner
- 03Metal foil: Cu or Al / conductive PSA / liner
- 04Absorber: magnetic-polymer sheet / optional PSA / liner
Teknik seçim için tanımlanmış ürün sınıfları.
Her ECLEAR modeli ayrı bir malzeme rolünü ve yapıyı tanımlar. Üretim karşılıkları izlenebilirlik için ECLEAR ürün ana verisinde kontrollü tutulur.
45 / 45 kayıt
ECLEAR modeliÜrün / rolYapı / tipik aralıkUygulamalar
EC-EM-CF-101Ürün sınıfı
10 µm Conductive Adhesive FilmTanımlı sınıf
Conductive acrylic adhesive film / release liner10 µm; 180° peel >=7 N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
10 micron conductive adhesive filmconductive PSA
EC-EM-CF-102Ürün sınıfı
20 µm Conductive Adhesive FilmTanımlı sınıf
Conductive acrylic adhesive film / release liner20 µm; 180° peel >=12 N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
20 micron conductive adhesive filmconductive PSA
EC-EM-CF-103Ürün sınıfı
30 µm Conductive Adhesive FilmTanımlı sınıf
Conductive acrylic adhesive film / release liner30 µm; 180° peel not individually stated N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
30 micron conductive adhesive filmconductive PSA
EC-EM-CF-104Ürün sınıfı
40 µm Conductive Adhesive FilmTanımlı sınıf
Conductive acrylic adhesive film / release liner40 µm; 180° peel not individually stated N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
40 micron conductive adhesive filmconductive PSA
EC-EM-CF-105Ürün sınıfı
50 µm Conductive Adhesive FilmTanımlı sınıf
Conductive acrylic adhesive film / release liner50 µm; 180° peel >=15 N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
50 micron conductive adhesive filmconductive PSA
EC-EM-CF-106Ürün sınıfı
100 µm Conductive Adhesive FilmTanımlı sınıf
Conductive acrylic adhesive film / release liner100 µm; 180° peel >=19 N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
100 micron conductive adhesive filmconductive PSA
EC-EM-NW-101Ürün sınıfı
15 µm Conductive Nonwoven Tape DevelopmentGeliştirme
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥6 N/25 mm (ASTM D3330); XY<0.2 Ω/sq; Z<0.02 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
FPC, PCB and antenna grounding
EC-EM-NW-102Ürün sınıfı
20 µm Conductive Nonwoven Tape DevelopmentGeliştirme
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥8 N/25 mm (ASTM D3330)
FPC, PCB and antenna grounding
EC-EM-NW-103Ürün sınıfı
30 µm Conductive Nonwoven Tape DevelopmentGeliştirme
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥10 N/25 mm (ASTM D3330); XY<0.1 Ω/sq
FPC, PCB and antenna grounding
EC-EM-NW-104Ürün sınıfı
50 µm Conformable Conductive Nonwoven Tape DevelopmentGeliştirme
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥12 N/25 mm (ASTM D3330); XY<0.2; Z<0.05 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Curved FPC and PCB grounding
EC-EM-NW-105Ürün sınıfı
100 µm Conductive Nonwoven Tape DevelopmentGeliştirme
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥15 N/25 mm (ASTM D3330); Z<0.08 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Gap-bridging conductive bonding
EC-EM-FB-101Ürün sınıfı
30 µm Single-Sided Conductive Fabric Tape DevelopmentGeliştirme
Conductive woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel: ≥8 N/25 mm (ASTM D3330); XY<0.1; Z<0.05 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Cable, antenna and camera-module shielding
EC-EM-FB-102Ürün sınıfı
50 µm Single-Sided Conductive Fabric Tape DevelopmentGeliştirme
Conductive woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel: ≥10 N/25 mm (ASTM D3330)
Cable, antenna and camera-module shielding
EC-EM-FB-103Ürün sınıfı
120 µm Single-Sided Conductive Fabric Tape DevelopmentGeliştirme
Conductive woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel: ≥12 N/25 mm (ASTM D3330); XY<0.2 Ω/sq
EMI wrapping and height compensation
EC-EM-FB-201Ürün sınıfı
30 µm Double-Sided Conductive Fabric Tape DevelopmentGeliştirme
Conductive acrylic PSA / woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥10 N/25 mm (ASTM D3330); XY<0.1 Ω/sq
FPC grounding and conductive assembly
EC-EM-FB-202Ürün sınıfı
50 µm Double-Sided Conductive Fabric Tape DevelopmentGeliştirme
Conductive acrylic PSA / woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥12 N/25 mm (ASTM D3330)
FPC grounding and conductive assembly
EC-EM-FB-203Ürün sınıfı
100 µm Double-Sided Conductive Fabric Tape DevelopmentGeliştirme
Conductive acrylic PSA / woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥15 N/25 mm (ASTM D3330); XY<0.2 Ω/sq
Grounding across moderate gaps
EC-EM-FB-204Ürün sınıfı
485 µm Conductive Fabric Spacer Tape DevelopmentGeliştirme
Conductive acrylic PSA / woven fabric spacer / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥18 N/25 mm (ASTM D3330); height-build construction
Large-step grounding and EMI contact
EC-EM-BK-101Ürün sınıfı
40 µm Matte-Black Conductive Fabric Tape DevelopmentGeliştirme
Matte-black conductive fabric / conductive acrylic PSA / linerDevelopment; 180° peel: ≥10 N/25 mm (ASTM D3330); conductive black coating
Display shielding and appearance control
EC-EM-BK-102Ürün sınıfı
50 µm Matte-Black Conductive Fabric Tape DevelopmentGeliştirme
Matte-black conductive fabric / conductive acrylic PSA / linerDevelopment; 50 µm
Display shielding and appearance control
EC-EM-BK-103Ürün sınıfı
50 µm Matte-Black Conductive Copper Tape DevelopmentGeliştirme
Matte-black thermal coating / copper foil / conductive acrylic PSA / linerDevelopment; 180° peel: ≥12 N/25 mm (ASTM D3330); matte heat-spreading coating
Shield cans and speaker modules
EC-EM-BK-104Ürün sınıfı
90 µm Black PI/Copper Composite Tape DevelopmentGeliştirme
Matte-black PI single-sided tape / copper foil composite / linerDevelopment; source table marks electrical paths nonconductive; insulating/conformable
Appearance and insulation over copper structures
EC-EM-BK-105Ürün sınıfı
25 µm Bright-Black Conductive Copper Tape DevelopmentGeliştirme
Bright-black conductive coating / copper foil / conductive acrylic PSA / linerDevelopment; conductive and alcohol-resistant
Compact EMI shielding with glossy-black appearance
EC-EM-CU-101Ürün sınıfı
30 µm Single-Sided Conductive Copper TapeTanımlı sınıf
Copper foil / conductive acrylic PSA / liner30 µm; 180° peel: ≥10 N/25 mm (ASTM D3330); XY<0.05; Z<0.03 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Grounding, seam shielding and heat spreading
30 micron copper foil tape
EC-EM-CU-102Ürün sınıfı
50 µm Single-Sided Conductive Copper TapeTanımlı sınıf
Copper foil / conductive acrylic PSA / liner50 µm; 180° peel: ≥12 N/25 mm (ASTM D3330); XY<0.05; Z<0.03 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Grounding and enclosure shielding
50 micron copper foil shielding tape
EC-EM-CU-103Ürün sınıfı
45 µm Conformable Single-Sided Copper TapeTanımlı sınıf
Copper foil / conductive acrylic PSA / liner45 µm; 180° peel: ≥12 N/25 mm (ASTM D3330); low resistance; appearance/conformability control
Shield-can and speaker grounding
conformable copper foil tape
EC-EM-CU-104Ürün sınıfı
25 µm Double-Sided Conductive Copper TapeTanımlı sınıf
Conductive acrylic PSA / copper foil / conductive acrylic PSA / liner25 µm; 180° peel, A and B: ≥8 N/25 mm (ASTM D3330); XY<0.05; Z<0.03 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Ultra-thin FPC grounding
ultra thin double sided copper tape
EC-EM-CU-105Ürün sınıfı
20 µm Double-Sided Conductive Copper TapeTanımlı sınıf
Conductive acrylic PSA / copper foil / conductive acrylic PSA / liner20 µm; 180° peel, A and B: ≥8 N/25 mm (ASTM D3330); XY<0.10; Z<0.05 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Ultra-thin conductive bonding
20 micron double sided copper tape
EC-EM-CU-106Ürün sınıfı
50 µm Double-Sided Conductive Copper TapeTanımlı sınıf
Conductive acrylic PSA / copper foil / conductive acrylic PSA / liner50 µm; 180° peel, A and B: ≥8 N/25 mm (ASTM D3330); XY<0.05; Z<0.03 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Conformable grounding and shielding
50 micron double sided copper tape
EC-EM-CU-107-DÜrün sınıfı
Damp-Heat-Resistant Black/Clear Copper Tape DevelopmentGeliştirme
9 µm clear PSA / 6 µm copper foil / 35 µm black PSA / linerDevelopment; 50±5 µm; dual-85 30-day anti-oxidation target
Long-life humid-heat EMI assemblies
EC-EM-AB-101Ürün sınıfı
0-3 GHz EMI Absorber, µ' 50±10Geliştirme
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 50±10; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-102Ürün sınıfı
0-3 GHz EMI Absorber, µ' 100±20Geliştirme
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 100±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-103Ürün sınıfı
0-3 GHz EMI Absorber, µ' 120±20Geliştirme
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 120±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-104Ürün sınıfı
0-3 GHz EMI Absorber, µ' 150±20Geliştirme
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 150±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-105Ürün sınıfı
0-3 GHz EMI Absorber, µ' 180±20Geliştirme
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 180±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-106Ürün sınıfı
0-3 GHz EMI Absorber, µ' 200±20Referans · veri doğrula
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerLifecycle conflict: present in S08, omitted from S09; permeability µ'@3 MHz 200±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-107Ürün sınıfı
0-3 GHz EMI Absorber, µ' 250±20Geliştirme
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 250±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-201Ürün sınıfı
0.13 High-Frequency EMI Absorber DevelopmentGeliştirme
High-frequency magnetic-polymer absorber / 0.03 mm PSA / linerDevelopment; 1-10 GHz; µ'@3 MHz 40±5; 0.13 mm total: 0.10 absorber + 0.03 PSA
2.4 GHz Wi-Fi, antenna and processor noise suppression
EC-EM-AB-202Ürün sınıfı
0.23 High-Frequency EMI Absorber DevelopmentGeliştirme
High-frequency magnetic-polymer absorber / 0.03 mm PSA / linerDevelopment; 1-10 GHz; µ'@3 MHz 40±5; 0.23 mm total: 0.20 absorber + 0.03 PSA
2.4 GHz Wi-Fi, antenna and processor noise suppression
EC-EM-AB-203Ürün sınıfı
0.33 High-Frequency EMI Absorber DevelopmentGeliştirme
High-frequency magnetic-polymer absorber / 0.03 mm PSA / linerDevelopment; 1-10 GHz; µ'@3 MHz 40±5; 0.33 mm total: 0.30 absorber + 0.03 PSA
2.4 GHz Wi-Fi, antenna and processor noise suppression
EC-EM-TC-101Ürün sınıfı
60 µm Brown Thermosetting Conductive FilmTanımlı sınıf
Brown thermosetting conductive adhesive film / release liner60 µm before and 40 µm after press; lap resistance ≤1 Ω at Φ = 1.0 mm; no initial tack; validate transfer, hot-press and cure conditions
SMT-reflow-compatible conductive bonding
thermosetting conductive adhesive film
EC-EM-TC-102Ürün sınıfı
60 µm Black Thermosetting Conductive FilmTanımlı sınıf
Black thermosetting conductive adhesive film / release liner60 µm before and 38 µm after press; lap resistance ≤2 Ω at Φ = 1.0 mm; no initial tack; validate transfer, hot-press and cure conditions
Black SMT-reflow-compatible conductive bonding
black thermosetting conductive film
EC-EM-TC-103Ürün sınıfı
40 µm Brown Thermosetting Conductive FilmTanımlı sınıf
Brown thermosetting conductive adhesive film / release liner40 µm before and 24 µm after press; lap resistance ≤1 Ω at Φ = 1.0 mm; no initial tack; validate transfer, hot-press and cure conditions
Thin conductive structural bonding
40 micron heat cure conductive adhesive
EC-EM-TC-104Ürün sınıfı
40 µm Black Thermosetting Conductive FilmTanımlı sınıf
Black thermosetting conductive adhesive film / release liner40 µm before and 25 µm after press; lap resistance ≤2 Ω at Φ = 1.0 mm; no initial tack; validate transfer, hot-press and cure conditions
Thin black conductive structural bonding
black heat activated conductive film
EC-EM-UV-101-DÜrün sınıfı
UV-Curable Gold-Plated Copper Tape DevelopmentGeliştirme
0.05-0.10 µm gold / 9 µm copper / 10 µm UV-conductive adhesive / linerDevelopment; 20±3 µm; low-PIM antenna-feed design
Antenna feedpoint conductive bonding
Grounding, shielding and absorption solve different electromagnetic paths.
01Conductive adhesive films, fabrics and metal foils create electrical paths that can bridge seams, ground components and reduce coupling when the enclosure and contact design are correct. The adhesive alone cannot guarantee system-level shielding.
02Absorbers use magnetic and dielectric loss in a polymer composite to attenuate electromagnetic energy over a grade-specific frequency range. Placement, thickness, field orientation and proximity to antennas or wireless-power coils can change the result.
03Resistance must be reported with direction, contact load, geometry and fixture. Shielding or absorption claims must state frequency and assembled test conditions; a generic high-performance statement is not technically meaningful.
Uygulamaya göre tanımlanan performans.
Faydalar hedef yüzey, proses ve nihai montaj üzerinde değerlendirilir.
01
Material selection by electrical function rather than one generic EMI claim
02
Conformable grounding options for compact assemblies
03
Metal-foil routes for low-resistance paths and enclosure shielding
04
Absorber materials for grade-specific field attenuation
Malzeme tanımından onaylı üretim yapısına.
Yeterlilik çalışması malzemeyi, dönüştürme yöntemini ve müşteri hattını birlikte ele alır.
01Locate source & victim
Identify the noise path, frequency, field type and sensitive circuit.
02Choose function
Separate grounding, seam shielding, field absorption and thermal needs.
03Design contact
Set material, die-cut direction, overlap, compression and ground points.
04Measure in assembly
Verify resistance and EMC performance before and after aging and rework.
Spesifikasyon yayımlanmadan önce toplanacak kanıtlar.
Temsilî yüzeyler, proses koşulları ve yaşlandırma dizileri kullanın.
- XY and Z resistance with stated load, contact area and fixture
- Ground-path continuity through tolerance and mechanical aging
- Shielding effectiveness at the relevant frequency and seam geometry
- Absorption or field attenuation with specified thickness and position
- Corrosion, adhesion, die-cut edge quality and rework durability
Değerler bir yöntem ve onaylı revizyon gerektirir.
Tipik değerler seçime yardımcı olur; kontrollü sınırlar onaylı TDS'den gelir.
ÖzellikTipik değer / aralıkKontrol
ResistanceDirection, pressure and geometry dependentState XY/Z and method
ShieldingAssembly dependentDefine frequency and fixture
AbsorptionFrequency/thickness dependentGrade-specific data
BondingSubstrate and aging dependentApproved peel/shear method
Tipik değerler spesifikasyon değildir. Nihai limitler onaylı ECLEAR TDS'sine ve müşteri doğrulamasına tabidir.
Hat denemesinden önce mühendislerin sorduğu sorular.
Numune öncesinde malzeme rolünü, ara yüzleri ve proses penceresini netleştirin.
Is an EMI absorber the same as a conductive shield?+
No. A conductive shield redirects or contains current and fields through a conductive structure; an absorber dissipates part of the electromagnetic energy through material loss. Some assemblies use both.
How are ECLEAR EMI grades selected?+
Selection starts with the shielding or absorption target, frequency range, available thickness, grounding path, assembly pressure and reliability profile. Named ECLEAR grades are then compared using the current controlled TDS and a representative device-level test.
Can ECLEAR recommend a grade from an application description alone?+
A first shortlist is possible, but a production recommendation requires the substrate, layer construction, equipment, process sequence, test method and acceptance criteria. ECLEAR normally moves from requirement definition to laboratory matching, samples, line trial and a frozen approved specification.
Are the values shown on this page guaranteed specifications?+
No. Website values and constructions are selection guidance. Guaranteed limits, test conditions, packaging and shelf life are controlled only by the latest ECLEAR-approved TDS, quality agreement and customer qualification record.
Bu platformun değerlendirildiği alanlar.
Her uygulama tam yapı uyumluluğu ve hat doğrulaması gerektirir.
PROSES PENCERESİ
Kontrol edilecek parametreler.
Yalnızca tek bir nominal ayarı değil, tüm proses penceresini kaydedin.
- Define whether the requirement is grounding, shielding, absorption or heat spreading.
- Control die-cut direction, contact area, compression and conductive path.
- Test resistance before and after representative aging and rework.
- Validate at the relevant frequency and assembled geometry.
SEÇİM SORULARI
Bilmemiz gerekenler.
Bu bilgiler ECLEAR'ın ürün sınıfını ve doğrulama planını daraltmasını sağlar.
- Q1What noise source, victim circuit and frequency range are involved?
- Q2Is a direct electrical path or field absorption required?
- Q3What thickness, compression and grounding points are available?
- Q4What thermal and environmental exposure occurs?
Disiplinli bir denemenin erken ortaya çıkarması gerekenler.
Erken hata kontrolleri ölçek büyütme riskini ve yanlış karşılaştırmaları azaltır.
!
Treating shielding and absorption as interchangeable
!
Reporting resistance without direction, load or geometry
!
Poor contact caused by insufficient pressure or surface contamination
!
Creating an unintended antenna or ground path in the assembly
Kontrollü teknik belgeler.
Seçilen ECLEAR ürün sınıfı ve uygulama için güncel revizyonu talep edin.
PDFÜrün bülteniBelge kontrol incelemesinden sonra sunulurTalep et →PDFÖzet TDSBelge kontrol incelemesinden sonra sunulurTalep et →PDFSDS ve uygunluk paketiBelge kontrol incelemesinden sonra sunulurTalep et →
Tipik yapılar ve uygulama kavramları yalnızca malzeme seçimi içindir. Bulunabilirlik, yapı, performans ve proses koşulları ürün sınıfına özgüdür ve güncel onaylı ECLEAR TDS'sine, uygulama testlerine ve nihai müşteri yeterliliğine tabidir.
İlgili malzeme sistemleri.
Aynı yapı veya proseste bu ürünle etkileşen bitişik malzemeleri inceleyin.
TEKNİK DANIŞMANLIK
Proje başlat ↗Tek bir malzemeyi değil, tüm yapıyı doğrulayın.
Odaklı bir öneri için yüzeyi, yapıyı, prosesi ve kabul ölçütlerini paylaşın.