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Materiales electrónicos

EMI Shielding, Grounding & Absorber Solutions

Consulte los modelos ECLEAR, la construcción del material, las aplicaciones, la ventana de proceso y los requisitos de validación de esta familia técnica.

Ilustración de aplicación: EMI Shielding, Grounding & Absorber Solutions
CONSTRUCCIÓN TÍPICA

Qué contiene la estructura del material.

Las capas se presentan en orden funcional; la construcción exacta depende de cada grado.

  1. 01Conductive adhesive: liner / conductive acrylic adhesive
  2. 02Fabric tape: conductive textile / conductive PSA / liner
  3. 03Metal foil: Cu or Al / conductive PSA / liner
  4. 04Absorber: magnetic-polymer sheet / optional PSA / liner
CATÁLOGO DE MODELOS ECLEAR

Grados identificados para la selección técnica.

Cada modelo ECLEAR representa una función y una construcción distintas. Las referencias de fabricación se controlan en el maestro de productos ECLEAR para garantizar la trazabilidad.

45 / 45 registros
Modelo ECLEARProducto / funciónConstrucción / rango típicoAplicaciones
EC-EM-CF-101Grado del producto
10 µm Conductive Adhesive FilmGrado especificado
Conductive acrylic adhesive film / release liner10 µm; 180° peel >=7 N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
10 micron conductive adhesive filmconductive PSA
EC-EM-CF-102Grado del producto
20 µm Conductive Adhesive FilmGrado especificado
Conductive acrylic adhesive film / release liner20 µm; 180° peel >=12 N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
20 micron conductive adhesive filmconductive PSA
EC-EM-CF-103Grado del producto
30 µm Conductive Adhesive FilmGrado especificado
Conductive acrylic adhesive film / release liner30 µm; 180° peel not individually stated N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
30 micron conductive adhesive filmconductive PSA
EC-EM-CF-104Grado del producto
40 µm Conductive Adhesive FilmGrado especificado
Conductive acrylic adhesive film / release liner40 µm; 180° peel not individually stated N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
40 micron conductive adhesive filmconductive PSA
EC-EM-CF-105Grado del producto
50 µm Conductive Adhesive FilmGrado especificado
Conductive acrylic adhesive film / release liner50 µm; 180° peel >=15 N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
50 micron conductive adhesive filmconductive PSA
EC-EM-CF-106Grado del producto
100 µm Conductive Adhesive FilmGrado especificado
Conductive acrylic adhesive film / release liner100 µm; 180° peel >=19 N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
100 micron conductive adhesive filmconductive PSA
EC-EM-NW-101Grado del producto
15 µm Conductive Nonwoven Tape DevelopmentDesarrollo
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥6 N/25 mm (ASTM D3330); XY<0.2 Ω/sq; Z<0.02 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
FPC, PCB and antenna grounding
EC-EM-NW-102Grado del producto
20 µm Conductive Nonwoven Tape DevelopmentDesarrollo
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥8 N/25 mm (ASTM D3330)
FPC, PCB and antenna grounding
EC-EM-NW-103Grado del producto
30 µm Conductive Nonwoven Tape DevelopmentDesarrollo
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥10 N/25 mm (ASTM D3330); XY<0.1 Ω/sq
FPC, PCB and antenna grounding
EC-EM-NW-104Grado del producto
50 µm Conformable Conductive Nonwoven Tape DevelopmentDesarrollo
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥12 N/25 mm (ASTM D3330); XY<0.2; Z<0.05 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Curved FPC and PCB grounding
EC-EM-NW-105Grado del producto
100 µm Conductive Nonwoven Tape DevelopmentDesarrollo
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥15 N/25 mm (ASTM D3330); Z<0.08 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Gap-bridging conductive bonding
EC-EM-FB-101Grado del producto
30 µm Single-Sided Conductive Fabric Tape DevelopmentDesarrollo
Conductive woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel: ≥8 N/25 mm (ASTM D3330); XY<0.1; Z<0.05 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Cable, antenna and camera-module shielding
EC-EM-FB-102Grado del producto
50 µm Single-Sided Conductive Fabric Tape DevelopmentDesarrollo
Conductive woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel: ≥10 N/25 mm (ASTM D3330)
Cable, antenna and camera-module shielding
EC-EM-FB-103Grado del producto
120 µm Single-Sided Conductive Fabric Tape DevelopmentDesarrollo
Conductive woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel: ≥12 N/25 mm (ASTM D3330); XY<0.2 Ω/sq
EMI wrapping and height compensation
EC-EM-FB-201Grado del producto
30 µm Double-Sided Conductive Fabric Tape DevelopmentDesarrollo
Conductive acrylic PSA / woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥10 N/25 mm (ASTM D3330); XY<0.1 Ω/sq
FPC grounding and conductive assembly
EC-EM-FB-202Grado del producto
50 µm Double-Sided Conductive Fabric Tape DevelopmentDesarrollo
Conductive acrylic PSA / woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥12 N/25 mm (ASTM D3330)
FPC grounding and conductive assembly
EC-EM-FB-203Grado del producto
100 µm Double-Sided Conductive Fabric Tape DevelopmentDesarrollo
Conductive acrylic PSA / woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥15 N/25 mm (ASTM D3330); XY<0.2 Ω/sq
Grounding across moderate gaps
EC-EM-FB-204Grado del producto
485 µm Conductive Fabric Spacer Tape DevelopmentDesarrollo
Conductive acrylic PSA / woven fabric spacer / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥18 N/25 mm (ASTM D3330); height-build construction
Large-step grounding and EMI contact
EC-EM-BK-101Grado del producto
40 µm Matte-Black Conductive Fabric Tape DevelopmentDesarrollo
Matte-black conductive fabric / conductive acrylic PSA / linerDevelopment; 180° peel: ≥10 N/25 mm (ASTM D3330); conductive black coating
Display shielding and appearance control
EC-EM-BK-102Grado del producto
50 µm Matte-Black Conductive Fabric Tape DevelopmentDesarrollo
Matte-black conductive fabric / conductive acrylic PSA / linerDevelopment; 50 µm
Display shielding and appearance control
EC-EM-BK-103Grado del producto
50 µm Matte-Black Conductive Copper Tape DevelopmentDesarrollo
Matte-black thermal coating / copper foil / conductive acrylic PSA / linerDevelopment; 180° peel: ≥12 N/25 mm (ASTM D3330); matte heat-spreading coating
Shield cans and speaker modules
EC-EM-BK-104Grado del producto
90 µm Black PI/Copper Composite Tape DevelopmentDesarrollo
Matte-black PI single-sided tape / copper foil composite / linerDevelopment; source table marks electrical paths nonconductive; insulating/conformable
Appearance and insulation over copper structures
EC-EM-BK-105Grado del producto
25 µm Bright-Black Conductive Copper Tape DevelopmentDesarrollo
Bright-black conductive coating / copper foil / conductive acrylic PSA / linerDevelopment; conductive and alcohol-resistant
Compact EMI shielding with glossy-black appearance
EC-EM-CU-101Grado del producto
30 µm Single-Sided Conductive Copper TapeGrado especificado
Copper foil / conductive acrylic PSA / liner30 µm; 180° peel: ≥10 N/25 mm (ASTM D3330); XY<0.05; Z<0.03 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Grounding, seam shielding and heat spreading
30 micron copper foil tape
EC-EM-CU-102Grado del producto
50 µm Single-Sided Conductive Copper TapeGrado especificado
Copper foil / conductive acrylic PSA / liner50 µm; 180° peel: ≥12 N/25 mm (ASTM D3330); XY<0.05; Z<0.03 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Grounding and enclosure shielding
50 micron copper foil shielding tape
EC-EM-CU-103Grado del producto
45 µm Conformable Single-Sided Copper TapeGrado especificado
Copper foil / conductive acrylic PSA / liner45 µm; 180° peel: ≥12 N/25 mm (ASTM D3330); low resistance; appearance/conformability control
Shield-can and speaker grounding
conformable copper foil tape
EC-EM-CU-104Grado del producto
25 µm Double-Sided Conductive Copper TapeGrado especificado
Conductive acrylic PSA / copper foil / conductive acrylic PSA / liner25 µm; 180° peel, A and B: ≥8 N/25 mm (ASTM D3330); XY<0.05; Z<0.03 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Ultra-thin FPC grounding
ultra thin double sided copper tape
EC-EM-CU-105Grado del producto
20 µm Double-Sided Conductive Copper TapeGrado especificado
Conductive acrylic PSA / copper foil / conductive acrylic PSA / liner20 µm; 180° peel, A and B: ≥8 N/25 mm (ASTM D3330); XY<0.10; Z<0.05 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Ultra-thin conductive bonding
20 micron double sided copper tape
EC-EM-CU-106Grado del producto
50 µm Double-Sided Conductive Copper TapeGrado especificado
Conductive acrylic PSA / copper foil / conductive acrylic PSA / liner50 µm; 180° peel, A and B: ≥8 N/25 mm (ASTM D3330); XY<0.05; Z<0.03 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Conformable grounding and shielding
50 micron double sided copper tape
EC-EM-CU-107-DGrado del producto
Damp-Heat-Resistant Black/Clear Copper Tape DevelopmentDesarrollo
9 µm clear PSA / 6 µm copper foil / 35 µm black PSA / linerDevelopment; 50±5 µm; dual-85 30-day anti-oxidation target
Long-life humid-heat EMI assemblies
EC-EM-AB-101Grado del producto
0-3 GHz EMI Absorber, µ' 50±10Desarrollo
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 50±10; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-102Grado del producto
0-3 GHz EMI Absorber, µ' 100±20Desarrollo
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 100±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-103Grado del producto
0-3 GHz EMI Absorber, µ' 120±20Desarrollo
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 120±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-104Grado del producto
0-3 GHz EMI Absorber, µ' 150±20Desarrollo
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 150±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-105Grado del producto
0-3 GHz EMI Absorber, µ' 180±20Desarrollo
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 180±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-106Grado del producto
0-3 GHz EMI Absorber, µ' 200±20Referencia · confirmar datos
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerLifecycle conflict: present in S08, omitted from S09; permeability µ'@3 MHz 200±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-107Grado del producto
0-3 GHz EMI Absorber, µ' 250±20Desarrollo
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 250±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-201Grado del producto
0.13 High-Frequency EMI Absorber DevelopmentDesarrollo
High-frequency magnetic-polymer absorber / 0.03 mm PSA / linerDevelopment; 1-10 GHz; µ'@3 MHz 40±5; 0.13 mm total: 0.10 absorber + 0.03 PSA
2.4 GHz Wi-Fi, antenna and processor noise suppression
EC-EM-AB-202Grado del producto
0.23 High-Frequency EMI Absorber DevelopmentDesarrollo
High-frequency magnetic-polymer absorber / 0.03 mm PSA / linerDevelopment; 1-10 GHz; µ'@3 MHz 40±5; 0.23 mm total: 0.20 absorber + 0.03 PSA
2.4 GHz Wi-Fi, antenna and processor noise suppression
EC-EM-AB-203Grado del producto
0.33 High-Frequency EMI Absorber DevelopmentDesarrollo
High-frequency magnetic-polymer absorber / 0.03 mm PSA / linerDevelopment; 1-10 GHz; µ'@3 MHz 40±5; 0.33 mm total: 0.30 absorber + 0.03 PSA
2.4 GHz Wi-Fi, antenna and processor noise suppression
EC-EM-TC-101Grado del producto
60 µm Brown Thermosetting Conductive FilmGrado especificado
Brown thermosetting conductive adhesive film / release liner60 µm before and 40 µm after press; lap resistance ≤1 Ω at Φ = 1.0 mm; no initial tack; validate transfer, hot-press and cure conditions
SMT-reflow-compatible conductive bonding
thermosetting conductive adhesive film
EC-EM-TC-102Grado del producto
60 µm Black Thermosetting Conductive FilmGrado especificado
Black thermosetting conductive adhesive film / release liner60 µm before and 38 µm after press; lap resistance ≤2 Ω at Φ = 1.0 mm; no initial tack; validate transfer, hot-press and cure conditions
Black SMT-reflow-compatible conductive bonding
black thermosetting conductive film
EC-EM-TC-103Grado del producto
40 µm Brown Thermosetting Conductive FilmGrado especificado
Brown thermosetting conductive adhesive film / release liner40 µm before and 24 µm after press; lap resistance ≤1 Ω at Φ = 1.0 mm; no initial tack; validate transfer, hot-press and cure conditions
Thin conductive structural bonding
40 micron heat cure conductive adhesive
EC-EM-TC-104Grado del producto
40 µm Black Thermosetting Conductive FilmGrado especificado
Black thermosetting conductive adhesive film / release liner40 µm before and 25 µm after press; lap resistance ≤2 Ω at Φ = 1.0 mm; no initial tack; validate transfer, hot-press and cure conditions
Thin black conductive structural bonding
black heat activated conductive film
EC-EM-UV-101-DGrado del producto
UV-Curable Gold-Plated Copper Tape DevelopmentDesarrollo
0.05-0.10 µm gold / 9 µm copper / 10 µm UV-conductive adhesive / linerDevelopment; 20±3 µm; low-PIM antenna-feed design
Antenna feedpoint conductive bonding
CÓMO FUNCIONA

Grounding, shielding and absorption solve different electromagnetic paths.

01Conductive adhesive films, fabrics and metal foils create electrical paths that can bridge seams, ground components and reduce coupling when the enclosure and contact design are correct. The adhesive alone cannot guarantee system-level shielding.

02Absorbers use magnetic and dielectric loss in a polymer composite to attenuate electromagnetic energy over a grade-specific frequency range. Placement, thickness, field orientation and proximity to antennas or wireless-power coils can change the result.

03Resistance must be reported with direction, contact load, geometry and fixture. Shielding or absorption claims must state frequency and assembled test conditions; a generic high-performance statement is not technically meaningful.

VENTAJAS CLAVE

Rendimiento definido por la aplicación.

Las ventajas se evalúan sobre el sustrato, el proceso y el conjunto final previstos.

01

Material selection by electrical function rather than one generic EMI claim

02

Conformable grounding options for compact assemblies

03

Metal-foil routes for low-resistance paths and enclosure shielding

04

Absorber materials for grade-specific field attenuation

FLUJO DE APLICACIÓN

De la definición del material a una estructura de producción homologada.

La homologación vincula el material, la conversión y la línea de producción del cliente.

01Locate source & victim

Identify the noise path, frequency, field type and sensitive circuit.

02Choose function

Separate grounding, seam shielding, field absorption and thermal needs.

03Design contact

Set material, die-cut direction, overlap, compression and ground points.

04Measure in assembly

Verify resistance and EMC performance before and after aging and rework.

PLAN DE VALIDACIÓN

Evidencias necesarias antes de aprobar la especificación.

Utilice sustratos, condiciones de proceso y secuencias de envejecimiento representativos.

  • XY and Z resistance with stated load, contact area and fixture
  • Ground-path continuity through tolerance and mechanical aging
  • Shielding effectiveness at the relevant frequency and seam geometry
  • Absorption or field attenuation with specified thickness and position
  • Corrosion, adhesion, die-cut edge quality and rework durability
PROPIEDADES TÍPICAS

Todo valor necesita un método y una revisión aprobada.

Los valores típicos orientan la selección; las especificaciones controladas proceden de la TDS aprobada.

PropiedadValor típico / rangoControl
ResistanceDirection, pressure and geometry dependentState XY/Z and method
ShieldingAssembly dependentDefine frequency and fixture
AbsorptionFrequency/thickness dependentGrade-specific data
BondingSubstrate and aging dependentApproved peel/shear method

Los valores típicos no son especificaciones. Los límites finales dependen de la TDS ECLEAR aprobada y de la validación del cliente.

PREGUNTAS TÉCNICAS

Preguntas de ingeniería antes de una prueba en línea.

Defina la función, las interfaces y la ventana de proceso antes de solicitar muestras.

Is an EMI absorber the same as a conductive shield?+

No. A conductive shield redirects or contains current and fields through a conductive structure; an absorber dissipates part of the electromagnetic energy through material loss. Some assemblies use both.

How are ECLEAR EMI grades selected?+

Selection starts with the shielding or absorption target, frequency range, available thickness, grounding path, assembly pressure and reliability profile. Named ECLEAR grades are then compared using the current controlled TDS and a representative device-level test.

Can ECLEAR recommend a grade from an application description alone?+

A first shortlist is possible, but a production recommendation requires the substrate, layer construction, equipment, process sequence, test method and acceptance criteria. ECLEAR normally moves from requirement definition to laboratory matching, samples, line trial and a frozen approved specification.

Are the values shown on this page guaranteed specifications?+

No. Website values and constructions are selection guidance. Guaranteed limits, test conditions, packaging and shelf life are controlled only by the latest ECLEAR-approved TDS, quality agreement and customer qualification record.

APLICACIONES RECOMENDADAS

Ámbitos de evaluación de esta plataforma.

Cada aplicación requiere comprobar la compatibilidad de la estructura y validar la línea.

FPC and PCB groundingCables and camerasAntenna and enclosure controlDisplays and processorsPower electronics
VENTANA DE PROCESO

Parámetros que deben controlarse.

Registre la ventana de proceso completa, no solo un ajuste nominal.

  • Define whether the requirement is grounding, shielding, absorption or heat spreading.
  • Control die-cut direction, contact area, compression and conductive path.
  • Test resistance before and after representative aging and rework.
  • Validate at the relevant frequency and assembled geometry.
PREGUNTAS DE SELECCIÓN

Información que necesitamos.

Estos datos permiten a ECLEAR limitar el grado y preparar el plan de validación.

  1. Q1What noise source, victim circuit and frequency range are involved?
  2. Q2Is a direct electrical path or field absorption required?
  3. Q3What thickness, compression and grounding points are available?
  4. Q4What thermal and environmental exposure occurs?
RIESGOS DE FALLO

Fallos que una prueba rigurosa debe revelar pronto.

Las verificaciones tempranas reducen el riesgo de escalado y las comparaciones erróneas.

!

Treating shielding and absorption as interchangeable

!

Reporting resistance without direction, load or geometry

!

Poor contact caused by insufficient pressure or surface contamination

!

Creating an unintended antenna or ground path in the assembly

DOCUMENTOS TÉCNICOS

Documentos técnicos controlados.

Solicite la revisión vigente para el grado ECLEAR y la aplicación seleccionados.

PDFBoletín de productoDisponible tras la revisión de control documentalSolicitar →PDFTDS simplificadaDisponible tras la revisión de control documentalSolicitar →PDFSDS y paquete de conformidadDisponible tras la revisión de control documentalSolicitar →

Las construcciones típicas y los conceptos de aplicación se facilitan solo para seleccionar materiales. La disponibilidad, la estructura, el rendimiento y las condiciones de proceso dependen del grado y están sujetos a la TDS ECLEAR vigente, las pruebas de aplicación y la homologación final del cliente.

PRODUCTOS RELACIONADOS

Sistemas de materiales relacionados.

Revise los materiales adyacentes que interactúan con este producto en la misma estructura o proceso.

EC-FP · EC-GR · EC-FM · EC-HTFPC, Graphite & Foam Process Films↗EC-EV · EC-FC · EC-SCEV Battery & Semiconductor Process Materials↗
CONSULTA TÉCNICA

Valide la estructura completa, no un material aislado.

Comparta el sustrato, la construcción, el proceso y los criterios de aceptación para recibir una recomendación precisa.

Iniciar un proyecto ↗
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