®Materiais eletrônicos
EMI Shielding, Grounding & Absorber Solutions
Consulte os modelos ECLEAR, a construção do material, as aplicações, a janela de processo e os requisitos de validação desta família técnica.
O que compõe a estrutura do material.
As camadas são apresentadas na ordem funcional; a construção exata depende do grau.
- 01Conductive adhesive: liner / conductive acrylic adhesive
- 02Fabric tape: conductive textile / conductive PSA / liner
- 03Metal foil: Cu or Al / conductive PSA / liner
- 04Absorber: magnetic-polymer sheet / optional PSA / liner
Graus identificados para seleção técnica.
Cada modelo ECLEAR representa uma função e uma construção distintas. As correspondências de fabricação permanecem controladas no cadastro mestre da ECLEAR para garantir rastreabilidade.
45 / 45 registros
Modelo ECLEARProduto / funçãoConstrução / faixa típicaAplicações
EC-EM-CF-101Grau do produto
10 µm Conductive Adhesive FilmGrau especificado
Conductive acrylic adhesive film / release liner10 µm; 180° peel >=7 N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
10 micron conductive adhesive filmconductive PSA
EC-EM-CF-102Grau do produto
20 µm Conductive Adhesive FilmGrau especificado
Conductive acrylic adhesive film / release liner20 µm; 180° peel >=12 N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
20 micron conductive adhesive filmconductive PSA
EC-EM-CF-103Grau do produto
30 µm Conductive Adhesive FilmGrau especificado
Conductive acrylic adhesive film / release liner30 µm; 180° peel not individually stated N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
30 micron conductive adhesive filmconductive PSA
EC-EM-CF-104Grau do produto
40 µm Conductive Adhesive FilmGrau especificado
Conductive acrylic adhesive film / release liner40 µm; 180° peel not individually stated N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
40 micron conductive adhesive filmconductive PSA
EC-EM-CF-105Grau do produto
50 µm Conductive Adhesive FilmGrau especificado
Conductive acrylic adhesive film / release liner50 µm; 180° peel >=15 N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
50 micron conductive adhesive filmconductive PSA
EC-EM-CF-106Grau do produto
100 µm Conductive Adhesive FilmGrau especificado
Conductive acrylic adhesive film / release liner100 µm; 180° peel >=19 N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
100 micron conductive adhesive filmconductive PSA
EC-EM-NW-101Grau do produto
15 µm Conductive Nonwoven Tape DevelopmentDesenvolvimento
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥6 N/25 mm (ASTM D3330); XY<0.2 Ω/sq; Z<0.02 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
FPC, PCB and antenna grounding
EC-EM-NW-102Grau do produto
20 µm Conductive Nonwoven Tape DevelopmentDesenvolvimento
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥8 N/25 mm (ASTM D3330)
FPC, PCB and antenna grounding
EC-EM-NW-103Grau do produto
30 µm Conductive Nonwoven Tape DevelopmentDesenvolvimento
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥10 N/25 mm (ASTM D3330); XY<0.1 Ω/sq
FPC, PCB and antenna grounding
EC-EM-NW-104Grau do produto
50 µm Conformable Conductive Nonwoven Tape DevelopmentDesenvolvimento
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥12 N/25 mm (ASTM D3330); XY<0.2; Z<0.05 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Curved FPC and PCB grounding
EC-EM-NW-105Grau do produto
100 µm Conductive Nonwoven Tape DevelopmentDesenvolvimento
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥15 N/25 mm (ASTM D3330); Z<0.08 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Gap-bridging conductive bonding
EC-EM-FB-101Grau do produto
30 µm Single-Sided Conductive Fabric Tape DevelopmentDesenvolvimento
Conductive woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel: ≥8 N/25 mm (ASTM D3330); XY<0.1; Z<0.05 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Cable, antenna and camera-module shielding
EC-EM-FB-102Grau do produto
50 µm Single-Sided Conductive Fabric Tape DevelopmentDesenvolvimento
Conductive woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel: ≥10 N/25 mm (ASTM D3330)
Cable, antenna and camera-module shielding
EC-EM-FB-103Grau do produto
120 µm Single-Sided Conductive Fabric Tape DevelopmentDesenvolvimento
Conductive woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel: ≥12 N/25 mm (ASTM D3330); XY<0.2 Ω/sq
EMI wrapping and height compensation
EC-EM-FB-201Grau do produto
30 µm Double-Sided Conductive Fabric Tape DevelopmentDesenvolvimento
Conductive acrylic PSA / woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥10 N/25 mm (ASTM D3330); XY<0.1 Ω/sq
FPC grounding and conductive assembly
EC-EM-FB-202Grau do produto
50 µm Double-Sided Conductive Fabric Tape DevelopmentDesenvolvimento
Conductive acrylic PSA / woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥12 N/25 mm (ASTM D3330)
FPC grounding and conductive assembly
EC-EM-FB-203Grau do produto
100 µm Double-Sided Conductive Fabric Tape DevelopmentDesenvolvimento
Conductive acrylic PSA / woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥15 N/25 mm (ASTM D3330); XY<0.2 Ω/sq
Grounding across moderate gaps
EC-EM-FB-204Grau do produto
485 µm Conductive Fabric Spacer Tape DevelopmentDesenvolvimento
Conductive acrylic PSA / woven fabric spacer / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥18 N/25 mm (ASTM D3330); height-build construction
Large-step grounding and EMI contact
EC-EM-BK-101Grau do produto
40 µm Matte-Black Conductive Fabric Tape DevelopmentDesenvolvimento
Matte-black conductive fabric / conductive acrylic PSA / linerDevelopment; 180° peel: ≥10 N/25 mm (ASTM D3330); conductive black coating
Display shielding and appearance control
EC-EM-BK-102Grau do produto
50 µm Matte-Black Conductive Fabric Tape DevelopmentDesenvolvimento
Matte-black conductive fabric / conductive acrylic PSA / linerDevelopment; 50 µm
Display shielding and appearance control
EC-EM-BK-103Grau do produto
50 µm Matte-Black Conductive Copper Tape DevelopmentDesenvolvimento
Matte-black thermal coating / copper foil / conductive acrylic PSA / linerDevelopment; 180° peel: ≥12 N/25 mm (ASTM D3330); matte heat-spreading coating
Shield cans and speaker modules
EC-EM-BK-104Grau do produto
90 µm Black PI/Copper Composite Tape DevelopmentDesenvolvimento
Matte-black PI single-sided tape / copper foil composite / linerDevelopment; source table marks electrical paths nonconductive; insulating/conformable
Appearance and insulation over copper structures
EC-EM-BK-105Grau do produto
25 µm Bright-Black Conductive Copper Tape DevelopmentDesenvolvimento
Bright-black conductive coating / copper foil / conductive acrylic PSA / linerDevelopment; conductive and alcohol-resistant
Compact EMI shielding with glossy-black appearance
EC-EM-CU-101Grau do produto
30 µm Single-Sided Conductive Copper TapeGrau especificado
Copper foil / conductive acrylic PSA / liner30 µm; 180° peel: ≥10 N/25 mm (ASTM D3330); XY<0.05; Z<0.03 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Grounding, seam shielding and heat spreading
30 micron copper foil tape
EC-EM-CU-102Grau do produto
50 µm Single-Sided Conductive Copper TapeGrau especificado
Copper foil / conductive acrylic PSA / liner50 µm; 180° peel: ≥12 N/25 mm (ASTM D3330); XY<0.05; Z<0.03 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Grounding and enclosure shielding
50 micron copper foil shielding tape
EC-EM-CU-103Grau do produto
45 µm Conformable Single-Sided Copper TapeGrau especificado
Copper foil / conductive acrylic PSA / liner45 µm; 180° peel: ≥12 N/25 mm (ASTM D3330); low resistance; appearance/conformability control
Shield-can and speaker grounding
conformable copper foil tape
EC-EM-CU-104Grau do produto
25 µm Double-Sided Conductive Copper TapeGrau especificado
Conductive acrylic PSA / copper foil / conductive acrylic PSA / liner25 µm; 180° peel, A and B: ≥8 N/25 mm (ASTM D3330); XY<0.05; Z<0.03 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Ultra-thin FPC grounding
ultra thin double sided copper tape
EC-EM-CU-105Grau do produto
20 µm Double-Sided Conductive Copper TapeGrau especificado
Conductive acrylic PSA / copper foil / conductive acrylic PSA / liner20 µm; 180° peel, A and B: ≥8 N/25 mm (ASTM D3330); XY<0.10; Z<0.05 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Ultra-thin conductive bonding
20 micron double sided copper tape
EC-EM-CU-106Grau do produto
50 µm Double-Sided Conductive Copper TapeGrau especificado
Conductive acrylic PSA / copper foil / conductive acrylic PSA / liner50 µm; 180° peel, A and B: ≥8 N/25 mm (ASTM D3330); XY<0.05; Z<0.03 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Conformable grounding and shielding
50 micron double sided copper tape
EC-EM-CU-107-DGrau do produto
Damp-Heat-Resistant Black/Clear Copper Tape DevelopmentDesenvolvimento
9 µm clear PSA / 6 µm copper foil / 35 µm black PSA / linerDevelopment; 50±5 µm; dual-85 30-day anti-oxidation target
Long-life humid-heat EMI assemblies
EC-EM-AB-101Grau do produto
0-3 GHz EMI Absorber, µ' 50±10Desenvolvimento
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 50±10; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-102Grau do produto
0-3 GHz EMI Absorber, µ' 100±20Desenvolvimento
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 100±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-103Grau do produto
0-3 GHz EMI Absorber, µ' 120±20Desenvolvimento
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 120±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-104Grau do produto
0-3 GHz EMI Absorber, µ' 150±20Desenvolvimento
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 150±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-105Grau do produto
0-3 GHz EMI Absorber, µ' 180±20Desenvolvimento
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 180±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-106Grau do produto
0-3 GHz EMI Absorber, µ' 200±20Referência · confirmar dados
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerLifecycle conflict: present in S08, omitted from S09; permeability µ'@3 MHz 200±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-107Grau do produto
0-3 GHz EMI Absorber, µ' 250±20Desenvolvimento
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 250±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-201Grau do produto
0.13 High-Frequency EMI Absorber DevelopmentDesenvolvimento
High-frequency magnetic-polymer absorber / 0.03 mm PSA / linerDevelopment; 1-10 GHz; µ'@3 MHz 40±5; 0.13 mm total: 0.10 absorber + 0.03 PSA
2.4 GHz Wi-Fi, antenna and processor noise suppression
EC-EM-AB-202Grau do produto
0.23 High-Frequency EMI Absorber DevelopmentDesenvolvimento
High-frequency magnetic-polymer absorber / 0.03 mm PSA / linerDevelopment; 1-10 GHz; µ'@3 MHz 40±5; 0.23 mm total: 0.20 absorber + 0.03 PSA
2.4 GHz Wi-Fi, antenna and processor noise suppression
EC-EM-AB-203Grau do produto
0.33 High-Frequency EMI Absorber DevelopmentDesenvolvimento
High-frequency magnetic-polymer absorber / 0.03 mm PSA / linerDevelopment; 1-10 GHz; µ'@3 MHz 40±5; 0.33 mm total: 0.30 absorber + 0.03 PSA
2.4 GHz Wi-Fi, antenna and processor noise suppression
EC-EM-TC-101Grau do produto
60 µm Brown Thermosetting Conductive FilmGrau especificado
Brown thermosetting conductive adhesive film / release liner60 µm before and 40 µm after press; lap resistance ≤1 Ω at Φ = 1.0 mm; no initial tack; validate transfer, hot-press and cure conditions
SMT-reflow-compatible conductive bonding
thermosetting conductive adhesive film
EC-EM-TC-102Grau do produto
60 µm Black Thermosetting Conductive FilmGrau especificado
Black thermosetting conductive adhesive film / release liner60 µm before and 38 µm after press; lap resistance ≤2 Ω at Φ = 1.0 mm; no initial tack; validate transfer, hot-press and cure conditions
Black SMT-reflow-compatible conductive bonding
black thermosetting conductive film
EC-EM-TC-103Grau do produto
40 µm Brown Thermosetting Conductive FilmGrau especificado
Brown thermosetting conductive adhesive film / release liner40 µm before and 24 µm after press; lap resistance ≤1 Ω at Φ = 1.0 mm; no initial tack; validate transfer, hot-press and cure conditions
Thin conductive structural bonding
40 micron heat cure conductive adhesive
EC-EM-TC-104Grau do produto
40 µm Black Thermosetting Conductive FilmGrau especificado
Black thermosetting conductive adhesive film / release liner40 µm before and 25 µm after press; lap resistance ≤2 Ω at Φ = 1.0 mm; no initial tack; validate transfer, hot-press and cure conditions
Thin black conductive structural bonding
black heat activated conductive film
EC-EM-UV-101-DGrau do produto
UV-Curable Gold-Plated Copper Tape DevelopmentDesenvolvimento
0.05-0.10 µm gold / 9 µm copper / 10 µm UV-conductive adhesive / linerDevelopment; 20±3 µm; low-PIM antenna-feed design
Antenna feedpoint conductive bonding
Grounding, shielding and absorption solve different electromagnetic paths.
01Conductive adhesive films, fabrics and metal foils create electrical paths that can bridge seams, ground components and reduce coupling when the enclosure and contact design are correct. The adhesive alone cannot guarantee system-level shielding.
02Absorbers use magnetic and dielectric loss in a polymer composite to attenuate electromagnetic energy over a grade-specific frequency range. Placement, thickness, field orientation and proximity to antennas or wireless-power coils can change the result.
03Resistance must be reported with direction, contact load, geometry and fixture. Shielding or absorption claims must state frequency and assembled test conditions; a generic high-performance statement is not technically meaningful.
Desempenho definido em torno da aplicação.
Os benefícios são avaliados no substrato, no processo e no conjunto final pretendidos.
01
Material selection by electrical function rather than one generic EMI claim
02
Conformable grounding options for compact assemblies
03
Metal-foil routes for low-resistance paths and enclosure shielding
04
Absorber materials for grade-specific field attenuation
Da definição do material a uma estrutura de produção qualificada.
A qualificação conecta o material, a conversão e a linha de produção do cliente.
01Locate source & victim
Identify the noise path, frequency, field type and sensitive circuit.
02Choose function
Separate grounding, seam shielding, field absorption and thermal needs.
03Design contact
Set material, die-cut direction, overlap, compression and ground points.
04Measure in assembly
Verify resistance and EMC performance before and after aging and rework.
Evidências a reunir antes da liberação da especificação.
Use substratos, condições de processo e sequências de envelhecimento representativos.
- XY and Z resistance with stated load, contact area and fixture
- Ground-path continuity through tolerance and mechanical aging
- Shielding effectiveness at the relevant frequency and seam geometry
- Absorption or field attenuation with specified thickness and position
- Corrosion, adhesion, die-cut edge quality and rework durability
Os valores exigem método e revisão aprovada.
Valores típicos orientam a seleção; os limites controlados vêm da TDS aprovada.
PropriedadeValor típico / faixaControle
ResistanceDirection, pressure and geometry dependentState XY/Z and method
ShieldingAssembly dependentDefine frequency and fixture
AbsorptionFrequency/thickness dependentGrade-specific data
BondingSubstrate and aging dependentApproved peel/shear method
Valores típicos não são especificações. Os limites finais dependem da TDS ECLEAR aprovada e da validação do cliente.
Perguntas dos engenheiros antes do teste em linha.
Defina a função, as interfaces e a janela de processo antes da amostragem.
Is an EMI absorber the same as a conductive shield?+
No. A conductive shield redirects or contains current and fields through a conductive structure; an absorber dissipates part of the electromagnetic energy through material loss. Some assemblies use both.
How are ECLEAR EMI grades selected?+
Selection starts with the shielding or absorption target, frequency range, available thickness, grounding path, assembly pressure and reliability profile. Named ECLEAR grades are then compared using the current controlled TDS and a representative device-level test.
Can ECLEAR recommend a grade from an application description alone?+
A first shortlist is possible, but a production recommendation requires the substrate, layer construction, equipment, process sequence, test method and acceptance criteria. ECLEAR normally moves from requirement definition to laboratory matching, samples, line trial and a frozen approved specification.
Are the values shown on this page guaranteed specifications?+
No. Website values and constructions are selection guidance. Guaranteed limits, test conditions, packaging and shelf life are controlled only by the latest ECLEAR-approved TDS, quality agreement and customer qualification record.
Onde esta plataforma é avaliada.
Cada aplicação ainda exige compatibilidade da estrutura completa e validação na linha.
JANELA DE PROCESSO
Parâmetros a controlar.
Registre a janela completa do processo, não apenas um ajuste nominal.
- Define whether the requirement is grounding, shielding, absorption or heat spreading.
- Control die-cut direction, contact area, compression and conductive path.
- Test resistance before and after representative aging and rework.
- Validate at the relevant frequency and assembled geometry.
PERGUNTAS DE SELEÇÃO
O que precisamos saber.
Essas informações permitem à ECLEAR restringir o grau e o plano de validação.
- Q1What noise source, victim circuit and frequency range are involved?
- Q2Is a direct electrical path or field absorption required?
- Q3What thickness, compression and grounding points are available?
- Q4What thermal and environmental exposure occurs?
O que um teste disciplinado deve revelar cedo.
As verificações antecipadas reduzem o risco de escala e evitam comparações incorretas.
!
Treating shielding and absorption as interchangeable
!
Reporting resistance without direction, load or geometry
!
Poor contact caused by insufficient pressure or surface contamination
!
Creating an unintended antenna or ground path in the assembly
Documentos técnicos controlados.
Solicite a revisão atual para o grau ECLEAR e a aplicação selecionados.
PDFBoletim do produtoDisponível após análise de controle documentalSolicitar →PDFTDS simplificadaDisponível após análise de controle documentalSolicitar →PDFSDS e pacote de conformidadeDisponível após análise de controle documentalSolicitar →
As construções típicas e os conceitos de aplicação são fornecidos apenas para a seleção do material. Disponibilidade, estrutura, desempenho e condições de processo dependem do grau e estão sujeitos à TDS ECLEAR vigente, aos testes de aplicação e à qualificação final do cliente.
Sistemas de materiais relacionados.
Revise os materiais adjacentes que interagem com este produto na mesma estrutura ou processo.
CONSULTORIA TÉCNICA
Iniciar um projeto ↗Valide a estrutura completa, não um material isolado.
Compartilhe o substrato, a construção, o processo e os critérios de aceitação para uma recomendação objetiva.