Material Elektronik

EV Battery & Semiconductor Process Materials

Tinjau model ECLEAR, konstruksi material, aplikasi, jendela proses, dan persyaratan validasi untuk keluarga teknis ini.

Ilustrasi aplikasi: EV Battery & Semiconductor Process Materials
KONSTRUKSI TIPIKAL

Isi struktur berlapis material.

Lapisan ditampilkan menurut urutan fungsi; konstruksi tepatnya bergantung pada grade.

  1. 01EV: application-specific insulation, flame-retardant, electrode and termination tapes/films
  2. 02Fuel cell: release liner / silicone adhesive / PEN film
  3. 03Semiconductor temporary tapes: carrier / responsive PSA / liner by process
  4. 04Permanent die-attach film: controlled adhesive stack; other thermal-process films: function and removal step require confirmation
KATALOG MODEL ECLEAR

Grade bernama untuk pemilihan teknis.

Setiap model ECLEAR mewakili peran material dan konstruksi yang berbeda. Padanan grade manufaktur dikendalikan dalam data induk produk ECLEAR untuk ketertelusuran.

17 / 17 rekaman
Model ECLEARProduk / peranKonstruksi / rentang tipikalAplikasi
EC-FC-101Grade produk
12 μm PEN Fuel-Cell Insulation and Fixation FilmReferensi · konfirmasi data
12 μm PEN / 12 μm silicone adhesive / 50 μm fluorinated release liner24 μm film-plus-adhesive total; peel 600 ± 120 g/25 mm; holding ≥96 h at 70°C under 1 kg; historical 85°C/4000 h test reported as passed
Internal electrical insulation and component fixation in fuel-cell assemblies
EC-FC-102Grade produk
25 μm PEN Fuel-Cell Insulation and Fixation FilmReferensi · konfirmasi data
25 μm PEN / 12 μm silicone adhesive / 50 μm fluorinated release liner37 μm film-plus-adhesive total; peel 600 ± 120 g/25 mm; holding ≥96 h at 70°C under 1 kg; historical 85°C/4000 h test reported as passed
Fuel-cell insulation and fixation requiring a thicker PEN support
EC-EV-IF-1xxSeri produk
EV Insulation-Film PlatformTinjauan teknis
Electrical insulation film / optional qualified adhesivePlatform only; no final source grade or frozen dielectric specification
Cell wrapping, module and CCS insulation
EC-EV-FR-1xxSeri produk
EV Flame-Retardant Tape PlatformTinjauan teknis
Flame-control carrier / pressure-sensitive adhesive / linerPlatform only; flame class and dielectric target must be qualified
Battery module and pack flame control
EC-EV-HF-1xxSeri produk
EV Hot-Pressed Film PlatformTinjauan teknis
Heat-activated bonding/insulation film / linerPlatform only; no final source grade
CCS integration and side-plate insulation
EC-EV-UV-1xxSeri produk
EV UV-Activated Film PlatformTinjauan teknis
UV-activated adhesive film / linerPlatform only; no final source grade
CCS film integration
EC-EV-ET-1xxSeri produk
Electrode Tape PlatformTinjauan teknis
Electrolyte-compatible carrier / adhesive / linerPlatform only; no final source grade
Electrode and tab fixation
EC-EV-TT-1xxSeri produk
Termination Tape PlatformTinjauan teknis
Insulating carrier / application-specific adhesive / linerPlatform only; no final source grade
Cell winding and soft-pack termination
EC-EV-MI-1xxSeri produk
Mica and Thermal-Barrier Bonding PlatformTinjauan teknis
Mica-compatible adhesive tape or film / linerPlatform only; no final source grade
Mica, aerogel and thermal-barrier sheet bonding
EC-EV-SA-1xxSeri produk
2K PU Battery Structural-Adhesive PlatformTinjauan teknis
Two-component polyurethane structural adhesivePlatform only; no final source grade
Cell-to-top/side plate and heating-sheet bonding
EC-SC-WG-1xxSeri produk
Wafer Grinding Tape PlatformTinjauan teknis
Carrier / temporary PSA / linerPlatform only; no final source grade or release mechanism supplied
Wafer back grinding and thinning
EC-SC-DT-1xxSeri produk
De-Taping Tape PlatformTinjauan teknis
Carrier / temporary PSAPlatform only; no final source grade supplied
Removal of back-grinding tape
EC-SC-WD-1xxSeri produk
Wafer Dicing Tape PlatformTinjauan teknis
Carrier / controlled-release PSA / linerPlatform only; no final source grade supplied
Wafer and chip singulation
EC-SC-DA-1xxSeri produk
Die-Attach Film PlatformTinjauan teknis
Permanent die-attach adhesive film / linersPlatform only; no final source grade or cure schedule supplied
Semiconductor die attach
EC-SC-TF-1xxSeri produk
Semiconductor Thermal-Process Film ReferenceReferensi · konfirmasi data
Construction and temporary/permanent role require confirmationReference labelled Thermal Film; function, removal step and final grade are not specified
Semiconductor process evaluation; exact interface requires confirmation
EC-SC-MR-1xxSeri produk
Molding Release Film PlatformTinjauan teknis
Heat-stable release filmPlatform only; no final source grade supplied
Semiconductor package molding
EC-SC-PS-1xxSeri produk
Package Singulation Tape PlatformTinjauan teknis
Carrier / temporary PSA / linerPlatform only; no final source grade supplied
Package cutting and singulation
CARA KERJA

Material role must remain explicit across energy and wafer processes.

01EV materials may remain permanently as electrical insulation, flame-control support, fixation, cushioning or structural bonding. Semiconductor materials can be temporary process tapes for grinding, de-taping, dicing and singulation, or permanent films such as selected die-attach materials.

02The same words—film, tape or release—can refer to very different lifecycle roles. Each drawing and process flow must state whether the material remains in the product, how it is activated and at which step it is removed.

03Electrical, thermal, chemical and mechanical performance are stack-level properties. Flame, dielectric, electrolyte, UV-release and wafer-pick claims require a defined standard, thickness, process and final-customer qualification.

MANFAAT UTAMA

Kinerja yang dinilai berdasarkan aplikasi.

Manfaat dievaluasi pada substrat, proses, dan rakitan akhir yang dituju.

01

Clear separation of temporary process films and permanent functional layers

02

Material families for cell, module, CCS and pack-level needs

03

Thin PEN-based fuel-cell insulation/fixation option

04

Process-tape coverage from wafer thinning through package singulation

ALUR KUALIFIKASI

Dari definisi material hingga struktur produksi yang terkualifikasi.

Kualifikasi menghubungkan material, jalur konversi, dan lini produksi pelanggan.

01Map lifecycle role

Permanent insulation/bonding or temporary process support and its removal step.

02Define exposure

Set voltage, heat, chemicals, compression, wafer process and activation route.

03Control application

Freeze thickness, coverage, edge design, dose/heat and equipment settings.

04Qualify the system

Test electrical, thermal, release, cleanliness and package reliability.

DAFTAR VALIDASI

Bukti yang dikumpulkan sebelum spesifikasi dirilis.

Gunakan substrat, kondisi proses, dan urutan penuaan yang mewakili penggunaan sebenarnya.

  • Dielectric, insulation and edge-coverage evaluation in the EV assembly
  • Thermal, flame and chemical testing to the named standard and thickness
  • UV or thermal release including shadow, edge and aged conditions
  • Wafer breakage, die fly, pick force, residue, low-k and ESD checks
  • DAF bondline, void, warpage, cure and package reliability where applicable
PROPERTI TIPIKAL

Setiap nilai memerlukan metode dan revisi yang disetujui.

Nilai tipikal membantu pemilihan; batas terkendali berasal dari TDS yang disetujui.

SifatNilai tipikal / rentangKontrol
ElectricalApplication-specific insulation/conductivityFinal assembly test
Thermal/flameGrade and stack dependentApproved regulatory method
ChemicalElectrolyte/process dependentCustomer exposure sequence
ReleaseUV, heat or mechanical by gradeDo not mix activation routes

Nilai tipikal bukan spesifikasi. Batas akhir tunduk pada TDS ECLEAR yang disetujui dan validasi pelanggan.

PERTANYAAN UMUM

Pertanyaan teknis sebelum uji coba lini.

Tentukan peran material, antarmuka, dan jendela proses sebelum meminta sampel.

How are EV and semiconductor material grades specified?+

ECLEAR publishes the applicable family and named grade where the construction is defined. The current controlled TDS then governs thickness, adhesive or film chemistry, process window, packaging and qualification for the intended line.

Can UV-debonding data be transferred between tools?+

No. Spectrum, irradiance, dose uniformity, substrate transmission and shadow areas can change the release result. The customer tool and full process must be validated.

Can ECLEAR recommend a grade from an application description alone?+

A first shortlist is possible, but a production recommendation requires the substrate, layer construction, equipment, process sequence, test method and acceptance criteria. ECLEAR normally moves from requirement definition to laboratory matching, samples, line trial and a frozen approved specification.

Are the values shown on this page guaranteed specifications?+

No. Website values and constructions are selection guidance. Guaranteed limits, test conditions, packaging and shelf life are controlled only by the latest ECLEAR-approved TDS, quality agreement and customer qualification record.

APLIKASI YANG DIREKOMENDASIKAN

Bidang evaluasi platform ini.

Setiap aplikasi tetap memerlukan kompatibilitas seluruh struktur dan validasi lini.

Cell and module insulationCCS and pack assemblyFuel-cell assembliesWafer grinding/dicingDie attachMolding and singulation
JENDELA PROSES

Parameter yang harus dikendalikan.

Catat seluruh jendela proses, bukan hanya satu pengaturan nominal.

  • Map the material role and removal step in the full process flow.
  • Validate electrical, chemical, thermal and aging requirements in the customer stack.
  • For process tapes, control dose or thermal activation and shadow/edge zones.
  • For permanent films, qualify cure, bondline and package reliability.
PERTANYAAN PEMILIHAN

Informasi yang kami perlukan.

Data ini membantu ECLEAR mempersempit grade dan rencana validasi.

  1. Q1Does the material remain in the product or leave during processing?
  2. Q2What voltage, temperature, flame and chemical environment applies?
  3. Q3Which process tool, activation route and cycle are used?
  4. Q4Which regulatory and customer standards control release?
RISIKO KEGAGALAN UMUM

Hal yang harus terungkap lebih awal dalam uji coba yang disiplin.

Pemeriksaan kegagalan dini mengurangi risiko peningkatan skala dan perbandingan material yang keliru.

!

Publishing family-level claims as a grade specification

!

Mixing temporary dicing tape with permanent die-attach film

!

Incomplete release in shadow areas or after thermal aging

!

Electrical or chemical failure from stack-level incompatibility

DOKUMEN UNDUHAN

Dokumen teknis terkendali.

Minta revisi terbaru untuk grade ECLEAR dan aplikasi yang dipilih.

Konstruksi tipikal dan konsep aplikasi diberikan hanya untuk pemilihan material. Ketersediaan, struktur, kinerja, dan kondisi proses bergantung pada grade serta tunduk pada TDS ECLEAR terbaru yang disetujui, pengujian aplikasi, dan kualifikasi akhir pelanggan.

PRODUK TERKAIT

Sistem material terkait.

Tinjau material di sekitarnya yang berinteraksi dengan produk ini dalam struktur atau proses yang sama.

KONSULTASI TEKNIS

Validasi seluruh struktur, bukan satu material saja.

Bagikan substrat, konstruksi, proses, dan kriteria penerimaan untuk memperoleh rekomendasi yang terarah.

Mulai proyek
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