®חומרים אלקטרוניים
EMI Shielding, Grounding & Absorber Solutions
עיינו בדגמי ECLEAR, במבנה החומר, ביישומים, בחלון התהליך ובדרישות האימות של משפחה טכנית זו.
מה מכיל מבנה החומר.
השכבות מוצגות לפי סדרן התפקודי; המבנה המדויק ייחודי לכל דרגה.
- 01Conductive adhesive: liner / conductive acrylic adhesive
- 02Fabric tape: conductive textile / conductive PSA / liner
- 03Metal foil: Cu or Al / conductive PSA / liner
- 04Absorber: magnetic-polymer sheet / optional PSA / liner
דרגות מזוהות לבחירה הנדסית.
כל דגם ECLEAR מגדיר תפקיד חומרי ומבנה ייחודיים. ההצלבות מול דרגות הייצור נשמרות באופן מבוקר במאגר האב של מוצרי ECLEAR לצורך עקיבות.
45 / 45 רשומות
דגם ECLEARמוצר / תפקידמבנה / טווח אופיינייישומים
EC-EM-CF-101דרגת מוצר
10 µm Conductive Adhesive Filmדרגה מוגדרת
Conductive acrylic adhesive film / release liner10 µm; 180° peel >=7 N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
10 micron conductive adhesive filmconductive PSA
EC-EM-CF-102דרגת מוצר
20 µm Conductive Adhesive Filmדרגה מוגדרת
Conductive acrylic adhesive film / release liner20 µm; 180° peel >=12 N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
20 micron conductive adhesive filmconductive PSA
EC-EM-CF-103דרגת מוצר
30 µm Conductive Adhesive Filmדרגה מוגדרת
Conductive acrylic adhesive film / release liner30 µm; 180° peel not individually stated N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
30 micron conductive adhesive filmconductive PSA
EC-EM-CF-104דרגת מוצר
40 µm Conductive Adhesive Filmדרגה מוגדרת
Conductive acrylic adhesive film / release liner40 µm; 180° peel not individually stated N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
40 micron conductive adhesive filmconductive PSA
EC-EM-CF-105דרגת מוצר
50 µm Conductive Adhesive Filmדרגה מוגדרת
Conductive acrylic adhesive film / release liner50 µm; 180° peel >=15 N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
50 micron conductive adhesive filmconductive PSA
EC-EM-CF-106דרגת מוצר
100 µm Conductive Adhesive Filmדרגה מוגדרת
Conductive acrylic adhesive film / release liner100 µm; 180° peel >=19 N/25 mm (ASTM D3330); copper-backed XY <0.10 and Z <0.03 Ω/□ tests (GB/T 42909-2023); confirm specimen geometry, load and Z-direction unit before specification
Laminating copper/aluminum foil, conductive fabric and FPC/PCB grounding
100 micron conductive adhesive filmconductive PSA
EC-EM-NW-101דרגת מוצר
15 µm Conductive Nonwoven Tape Developmentבפיתוח
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥6 N/25 mm (ASTM D3330); XY<0.2 Ω/sq; Z<0.02 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
FPC, PCB and antenna grounding
EC-EM-NW-102דרגת מוצר
20 µm Conductive Nonwoven Tape Developmentבפיתוח
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥8 N/25 mm (ASTM D3330)
FPC, PCB and antenna grounding
EC-EM-NW-103דרגת מוצר
30 µm Conductive Nonwoven Tape Developmentבפיתוח
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥10 N/25 mm (ASTM D3330); XY<0.1 Ω/sq
FPC, PCB and antenna grounding
EC-EM-NW-104דרגת מוצר
50 µm Conformable Conductive Nonwoven Tape Developmentבפיתוח
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥12 N/25 mm (ASTM D3330); XY<0.2; Z<0.05 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Curved FPC and PCB grounding
EC-EM-NW-105דרגת מוצר
100 µm Conductive Nonwoven Tape Developmentבפיתוח
Conductive acrylic PSA / conductive nonwoven / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥15 N/25 mm (ASTM D3330); Z<0.08 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Gap-bridging conductive bonding
EC-EM-FB-101דרגת מוצר
30 µm Single-Sided Conductive Fabric Tape Developmentבפיתוח
Conductive woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel: ≥8 N/25 mm (ASTM D3330); XY<0.1; Z<0.05 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Cable, antenna and camera-module shielding
EC-EM-FB-102דרגת מוצר
50 µm Single-Sided Conductive Fabric Tape Developmentבפיתוח
Conductive woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel: ≥10 N/25 mm (ASTM D3330)
Cable, antenna and camera-module shielding
EC-EM-FB-103דרגת מוצר
120 µm Single-Sided Conductive Fabric Tape Developmentבפיתוח
Conductive woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel: ≥12 N/25 mm (ASTM D3330); XY<0.2 Ω/sq
EMI wrapping and height compensation
EC-EM-FB-201דרגת מוצר
30 µm Double-Sided Conductive Fabric Tape Developmentבפיתוח
Conductive acrylic PSA / woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥10 N/25 mm (ASTM D3330); XY<0.1 Ω/sq
FPC grounding and conductive assembly
EC-EM-FB-202דרגת מוצר
50 µm Double-Sided Conductive Fabric Tape Developmentבפיתוח
Conductive acrylic PSA / woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥12 N/25 mm (ASTM D3330)
FPC grounding and conductive assembly
EC-EM-FB-203דרגת מוצר
100 µm Double-Sided Conductive Fabric Tape Developmentבפיתוח
Conductive acrylic PSA / woven fabric / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥15 N/25 mm (ASTM D3330); XY<0.2 Ω/sq
Grounding across moderate gaps
EC-EM-FB-204דרגת מוצר
485 µm Conductive Fabric Spacer Tape Developmentבפיתוח
Conductive acrylic PSA / woven fabric spacer / conductive acrylic PSA / linerDevelopment; 180° peel, A and B: ≥18 N/25 mm (ASTM D3330); height-build construction
Large-step grounding and EMI contact
EC-EM-BK-101דרגת מוצר
40 µm Matte-Black Conductive Fabric Tape Developmentבפיתוח
Matte-black conductive fabric / conductive acrylic PSA / linerDevelopment; 180° peel: ≥10 N/25 mm (ASTM D3330); conductive black coating
Display shielding and appearance control
EC-EM-BK-102דרגת מוצר
50 µm Matte-Black Conductive Fabric Tape Developmentבפיתוח
Matte-black conductive fabric / conductive acrylic PSA / linerDevelopment; 50 µm
Display shielding and appearance control
EC-EM-BK-103דרגת מוצר
50 µm Matte-Black Conductive Copper Tape Developmentבפיתוח
Matte-black thermal coating / copper foil / conductive acrylic PSA / linerDevelopment; 180° peel: ≥12 N/25 mm (ASTM D3330); matte heat-spreading coating
Shield cans and speaker modules
EC-EM-BK-104דרגת מוצר
90 µm Black PI/Copper Composite Tape Developmentבפיתוח
Matte-black PI single-sided tape / copper foil composite / linerDevelopment; source table marks electrical paths nonconductive; insulating/conformable
Appearance and insulation over copper structures
EC-EM-BK-105דרגת מוצר
25 µm Bright-Black Conductive Copper Tape Developmentבפיתוח
Bright-black conductive coating / copper foil / conductive acrylic PSA / linerDevelopment; conductive and alcohol-resistant
Compact EMI shielding with glossy-black appearance
EC-EM-CU-101דרגת מוצר
30 µm Single-Sided Conductive Copper Tapeדרגה מוגדרת
Copper foil / conductive acrylic PSA / liner30 µm; 180° peel: ≥10 N/25 mm (ASTM D3330); XY<0.05; Z<0.03 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Grounding, seam shielding and heat spreading
30 micron copper foil tape
EC-EM-CU-102דרגת מוצר
50 µm Single-Sided Conductive Copper Tapeדרגה מוגדרת
Copper foil / conductive acrylic PSA / liner50 µm; 180° peel: ≥12 N/25 mm (ASTM D3330); XY<0.05; Z<0.03 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Grounding and enclosure shielding
50 micron copper foil shielding tape
EC-EM-CU-103דרגת מוצר
45 µm Conformable Single-Sided Copper Tapeדרגה מוגדרת
Copper foil / conductive acrylic PSA / liner45 µm; 180° peel: ≥12 N/25 mm (ASTM D3330); low resistance; appearance/conformability control
Shield-can and speaker grounding
conformable copper foil tape
EC-EM-CU-104דרגת מוצר
25 µm Double-Sided Conductive Copper Tapeדרגה מוגדרת
Conductive acrylic PSA / copper foil / conductive acrylic PSA / liner25 µm; 180° peel, A and B: ≥8 N/25 mm (ASTM D3330); XY<0.05; Z<0.03 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Ultra-thin FPC grounding
ultra thin double sided copper tape
EC-EM-CU-105דרגת מוצר
20 µm Double-Sided Conductive Copper Tapeדרגה מוגדרת
Conductive acrylic PSA / copper foil / conductive acrylic PSA / liner20 µm; 180° peel, A and B: ≥8 N/25 mm (ASTM D3330); XY<0.10; Z<0.05 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Ultra-thin conductive bonding
20 micron double sided copper tape
EC-EM-CU-106דרגת מוצר
50 µm Double-Sided Conductive Copper Tapeדרגה מוגדרת
Conductive acrylic PSA / copper foil / conductive acrylic PSA / liner50 µm; 180° peel, A and B: ≥8 N/25 mm (ASTM D3330); XY<0.05; Z<0.03 Ω/sq; XY/Z retain source notation: confirm the fixture, load, contact area and Z-direction unit before specification
Conformable grounding and shielding
50 micron double sided copper tape
EC-EM-CU-107-Dדרגת מוצר
Damp-Heat-Resistant Black/Clear Copper Tape Developmentבפיתוח
9 µm clear PSA / 6 µm copper foil / 35 µm black PSA / linerDevelopment; 50±5 µm; dual-85 30-day anti-oxidation target
Long-life humid-heat EMI assemblies
EC-EM-AB-101דרגת מוצר
0-3 GHz EMI Absorber, µ' 50±10בפיתוח
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 50±10; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-102דרגת מוצר
0-3 GHz EMI Absorber, µ' 100±20בפיתוח
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 100±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-103דרגת מוצר
0-3 GHz EMI Absorber, µ' 120±20בפיתוח
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 120±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-104דרגת מוצר
0-3 GHz EMI Absorber, µ' 150±20בפיתוח
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 150±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-105דרגת מוצר
0-3 GHz EMI Absorber, µ' 180±20בפיתוח
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 180±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-106דרגת מוצר
0-3 GHz EMI Absorber, µ' 200±20לעיון · יש לאמת נתונים
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerLifecycle conflict: present in S08, omitted from S09; permeability µ'@3 MHz 200±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-107דרגת מוצר
0-3 GHz EMI Absorber, µ' 250±20בפיתוח
Magnetic-polymer absorber sheet / optional PET double-sided PSA / linerDevelopment; permeability µ'@3 MHz 250±20; absorber thickness options 0.03-0.50 mm
Display backplates, CPU/GPU and wireless-charging noise suppression
EC-EM-AB-201דרגת מוצר
0.13 High-Frequency EMI Absorber Developmentבפיתוח
High-frequency magnetic-polymer absorber / 0.03 mm PSA / linerDevelopment; 1-10 GHz; µ'@3 MHz 40±5; 0.13 mm total: 0.10 absorber + 0.03 PSA
2.4 GHz Wi-Fi, antenna and processor noise suppression
EC-EM-AB-202דרגת מוצר
0.23 High-Frequency EMI Absorber Developmentבפיתוח
High-frequency magnetic-polymer absorber / 0.03 mm PSA / linerDevelopment; 1-10 GHz; µ'@3 MHz 40±5; 0.23 mm total: 0.20 absorber + 0.03 PSA
2.4 GHz Wi-Fi, antenna and processor noise suppression
EC-EM-AB-203דרגת מוצר
0.33 High-Frequency EMI Absorber Developmentבפיתוח
High-frequency magnetic-polymer absorber / 0.03 mm PSA / linerDevelopment; 1-10 GHz; µ'@3 MHz 40±5; 0.33 mm total: 0.30 absorber + 0.03 PSA
2.4 GHz Wi-Fi, antenna and processor noise suppression
EC-EM-TC-101דרגת מוצר
60 µm Brown Thermosetting Conductive Filmדרגה מוגדרת
Brown thermosetting conductive adhesive film / release liner60 µm before and 40 µm after press; lap resistance ≤1 Ω at Φ = 1.0 mm; no initial tack; validate transfer, hot-press and cure conditions
SMT-reflow-compatible conductive bonding
thermosetting conductive adhesive film
EC-EM-TC-102דרגת מוצר
60 µm Black Thermosetting Conductive Filmדרגה מוגדרת
Black thermosetting conductive adhesive film / release liner60 µm before and 38 µm after press; lap resistance ≤2 Ω at Φ = 1.0 mm; no initial tack; validate transfer, hot-press and cure conditions
Black SMT-reflow-compatible conductive bonding
black thermosetting conductive film
EC-EM-TC-103דרגת מוצר
40 µm Brown Thermosetting Conductive Filmדרגה מוגדרת
Brown thermosetting conductive adhesive film / release liner40 µm before and 24 µm after press; lap resistance ≤1 Ω at Φ = 1.0 mm; no initial tack; validate transfer, hot-press and cure conditions
Thin conductive structural bonding
40 micron heat cure conductive adhesive
EC-EM-TC-104דרגת מוצר
40 µm Black Thermosetting Conductive Filmדרגה מוגדרת
Black thermosetting conductive adhesive film / release liner40 µm before and 25 µm after press; lap resistance ≤2 Ω at Φ = 1.0 mm; no initial tack; validate transfer, hot-press and cure conditions
Thin black conductive structural bonding
black heat activated conductive film
EC-EM-UV-101-Dדרגת מוצר
UV-Curable Gold-Plated Copper Tape Developmentבפיתוח
0.05-0.10 µm gold / 9 µm copper / 10 µm UV-conductive adhesive / linerDevelopment; 20±3 µm; low-PIM antenna-feed design
Antenna feedpoint conductive bonding
Grounding, shielding and absorption solve different electromagnetic paths.
01Conductive adhesive films, fabrics and metal foils create electrical paths that can bridge seams, ground components and reduce coupling when the enclosure and contact design are correct. The adhesive alone cannot guarantee system-level shielding.
02Absorbers use magnetic and dielectric loss in a polymer composite to attenuate electromagnetic energy over a grade-specific frequency range. Placement, thickness, field orientation and proximity to antennas or wireless-power coils can change the result.
03Resistance must be reported with direction, contact load, geometry and fixture. Shielding or absorption claims must state frequency and assembled test conditions; a generic high-performance statement is not technically meaningful.
ביצועים המוגדרים בהקשר היישום.
היתרונות נבחנים על המצע, בתהליך ובהרכבה הסופית המיועדים.
01
Material selection by electrical function rather than one generic EMI claim
02
Conformable grounding options for compact assemblies
03
Metal-foil routes for low-resistance paths and enclosure shielding
04
Absorber materials for grade-specific field attenuation
מהגדרת החומר ועד למבנה ייצור שעבר הסמכה.
ההסמכה מקשרת בין החומר, מסלול העיבוד וקו הייצור של הלקוח.
01Locate source & victim
Identify the noise path, frequency, field type and sensitive circuit.
02Choose function
Separate grounding, seam shielding, field absorption and thermal needs.
03Design contact
Set material, die-cut direction, overlap, compression and ground points.
04Measure in assembly
Verify resistance and EMC performance before and after aging and rework.
הראיות שיש לאסוף לפני אישור המפרט.
יש להשתמש במצעים, בתנאי תהליך וברצפי התיישנות המייצגים את היישום בפועל.
- XY and Z resistance with stated load, contact area and fixture
- Ground-path continuity through tolerance and mechanical aging
- Shielding effectiveness at the relevant frequency and seam geometry
- Absorption or field attenuation with specified thickness and position
- Corrosion, adhesion, die-cut edge quality and rework durability
ערכים דורשים שיטת בדיקה ומהדורה מאושרת.
ערכים אופייניים תומכים בבחירה; המפרטים המבוקרים מופיעים ב־TDS המאושר.
מאפייןערך אופייני / טווחבקרה
ResistanceDirection, pressure and geometry dependentState XY/Z and method
ShieldingAssembly dependentDefine frequency and fixture
AbsorptionFrequency/thickness dependentGrade-specific data
BondingSubstrate and aging dependentApproved peel/shear method
ערכים טיפוסיים אינם מפרט מובטח. הגבולות הסופיים כפופים ל-TDS מאושר של ECLEAR ולאימות הלקוח.
שאלות שמהנדסים שואלים לפני ניסוי בקו.
יש להגדיר את תפקיד החומר, הממשקים וחלון התהליך לפני הזמנת דוגמאות.
Is an EMI absorber the same as a conductive shield?+
No. A conductive shield redirects or contains current and fields through a conductive structure; an absorber dissipates part of the electromagnetic energy through material loss. Some assemblies use both.
How are ECLEAR EMI grades selected?+
Selection starts with the shielding or absorption target, frequency range, available thickness, grounding path, assembly pressure and reliability profile. Named ECLEAR grades are then compared using the current controlled TDS and a representative device-level test.
Can ECLEAR recommend a grade from an application description alone?+
A first shortlist is possible, but a production recommendation requires the substrate, layer construction, equipment, process sequence, test method and acceptance criteria. ECLEAR normally moves from requirement definition to laboratory matching, samples, line trial and a frozen approved specification.
Are the values shown on this page guaranteed specifications?+
No. Website values and constructions are selection guidance. Guaranteed limits, test conditions, packaging and shelf life are controlled only by the latest ECLEAR-approved TDS, quality agreement and customer qualification record.
היכן פלטפורמה זו נבחנת.
כל יישום עדיין דורש בדיקת תאימות ברמת המבנה המלא ואימות בקו הייצור.
חלון תהליך
פרמטרים שיש לבקר.
יש לתעד את חלון התהליך המלא, ולא רק הגדרה נומינלית אחת.
- Define whether the requirement is grounding, shielding, absorption or heat spreading.
- Control die-cut direction, contact area, compression and conductive path.
- Test resistance before and after representative aging and rework.
- Validate at the relevant frequency and assembled geometry.
שאלות לבחירה
מה עלינו לדעת.
נתונים אלה מאפשרים ל־ECLEAR לצמצם את בחירת הדרגה ולהגדיר את תוכנית האימות.
- Q1What noise source, victim circuit and frequency range are involved?
- Q2Is a direct electrical path or field absorption required?
- Q3What thickness, compression and grounding points are available?
- Q4What thermal and environmental exposure occurs?
מה ניסוי שיטתי צריך לחשוף בשלב מוקדם.
בדיקות כשל מוקדמות מפחיתות את סיכוני ההרחבה ומונעות השוואות שגויות בין חומרים.
!
Treating shielding and absorption as interchangeable
!
Reporting resistance without direction, load or geometry
!
Poor contact caused by insufficient pressure or surface contamination
!
Creating an unintended antenna or ground path in the assembly
מסמכים טכניים מבוקרים.
יש לבקש את המהדורה העדכנית עבור דרגת ECLEAR והיישום שנבחרו.
PDFעלון מוצרזמין לאחר בדיקת בקרת מסמכיםבקשה →PDFTDS מקוצרזמין לאחר בדיקת בקרת מסמכיםבקשה →PDFחבילת SDS ותאימותזמין לאחר בדיקת בקרת מסמכיםבקשה →
מבנים אופייניים ותפיסות יישום ניתנים לצורכי בחירת חומר בלבד. הזמינות, המבנה, הביצועים ותנאי התהליך ייחודיים לכל דרגה וכפופים ל־TDS העדכני שאושר בידי ECLEAR, לבדיקות יישום ולהסמכה הסופית של הלקוח.
מערכות חומרים קשורות.
יש לבחון חומרים סמוכים המקיימים אינטראקציה עם מוצר זה באותו מבנה או תהליך.
ייעוץ טכני
התחלת פרויקט ↗יש לאמת את המבנה המלא, ולא חומר בודד.
שתפו את פרטי המצע, המבנה, התהליך וקריטריוני הקבלה לקבלת המלצה ממוקדת.